| CAO Wei,DENG Zhao-hui,LI Zhong-yang,GE Ji-min.Polishing Pad in Chemical Mechanical Polishing[J],51(7):27-41 |
| Polishing Pad in Chemical Mechanical Polishing |
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| DOI：10.16490/j.cnki.issn.1001-3660.2022.07.003 |
| KeyWord:chemical mechanical polishing polishing pad design and preparation wear conditioning |
| Author | Institution |
| CAO Wei |
Hunan Provincial Key Laboratory of High Efficiency and Precision Machining of Difficult-to-Cut Materials,Hunan Xiangtan , China ;School of Mechanical Engineering, Hunan University of Science and Technology, Hunan Xiangtan , China |
| DENG Zhao-hui |
Hunan Provincial Key Laboratory of High Efficiency and Precision Machining of Difficult-to-Cut Materials,Hunan Xiangtan , China ;School of Mechanical Engineering, Hunan University of Science and Technology, Hunan Xiangtan , China |
| LI Zhong-yang |
Hunan Provincial Key Laboratory of High Efficiency and Precision Machining of Difficult-to-Cut Materials,Hunan Xiangtan , China ;School of Mechanical Engineering, Hunan University of Science and Technology, Hunan Xiangtan , China |
| GE Ji-min |
Hunan Provincial Key Laboratory of High Efficiency and Precision Machining of Difficult-to-Cut Materials,Hunan Xiangtan , China ;School of Mechanical Engineering, Hunan University of Science and Technology, Hunan Xiangtan , China |
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| Abstract: |
| As an ultra-precision machining technology, chemical mechanical polishing (CMP) has been widely used in integrated circuit manufacturing, computer hard disk, micro electro mechanical system, optical element processing and other fields. The design and preparation, the wear status and the conditioning of the polishing pad all have influence on CMP. In this paper, the research on the design and preparation of polishing pad is summarized from three aspects:polishing pad substrate, polishing pad surface texture and polishing pad structure. The polishing effect of the polishing pad with different substrates is introduced emphatically and therefore their advantages and disadvantages are concluded. Besides, the polishing pad wear in the processes of polishing and conditioning is introduced, and the wear models of polishing pad established by different researchers are compared. The research status of the polishing pad wear monitoring technology is introduced, and the fact that the current monitoring method of polishing pad wear is relatively simple is pointed out thus, which can be improved by fusion of multi-sensor signals to get higher monitoring accuracy. Next, in order to further explore the influence of polishing pad conditioning on polishing performance, the structure parameters of the conditioner and the effect of conditioning parameters on the conditioning are studied. Subsequently, several conditioners with new structures are introduced, and the research progress of polishing pad self-conditioning technology is summarized. Finally, through the analysis of the three aspects above, the existing problems in the research of polishing pad design and preparation, polishing pad wear, and polishing pad conditioning, and the prospect of polishing pad development are discussed. |
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