CUI Feng-dan,CI Ji-liang,WU Chun-bo,YANG Jing,GAO Wen-bo,ZHANG Jian,LYU Yi,ZHANG Hao.Effects of Screen Printing and Sintering Process on Film Structure and Properties of Ceramic Matrix Composite Microstrip Patch Antenna[J],51(3):234-241
Effects of Screen Printing and Sintering Process on Film Structure and Properties of Ceramic Matrix Composite Microstrip Patch Antenna
Received:March 28, 2021  Revised:October 21, 2021
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DOI:10.16490/j.cnki.issn.1001-3660.2022.03.025
KeyWord:microstrip patch antenna  ceramic matrix composites  screen printing  sintering system  standing wave performance
                       
AuthorInstitution
CUI Feng-dan Aerospace Institute of Advanced Materials & Processing Technology, Beijing , China
CI Ji-liang Aerospace Institute of Advanced Materials & Processing Technology, Beijing , China
WU Chun-bo Beijing Institute of Mechanical and Electrical Engineering, Beijing , China
YANG Jing Aerospace Institute of Advanced Materials & Processing Technology, Beijing , China
GAO Wen-bo Aerospace Institute of Advanced Materials & Processing Technology, Beijing , China
ZHANG Jian Aerospace Institute of Advanced Materials & Processing Technology, Beijing , China
LYU Yi Aerospace Institute of Advanced Materials & Processing Technology, Beijing , China
ZHANG Hao Aerospace Institute of Advanced Materials & Processing Technology, Beijing , China
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Abstract:
      The effect of screen printing process parameters (printing pressure, off-screen distance and printing speed) and sintering system (sintering temperature and holding time) on structure and properties of screen-printed silver film on the surface of ceramic matrix composite microstrip patch antenna substrate were studied in this work. The silver film layer was prepared on the surface of the quartz fiber reinforced silica matrix composite material by screen printing process and sintering at a specified temperature. The microscopic morphology, square resistance and adhesion strength of the silver film layer were studied by metallographic microscope, scanning electron microscope, four-point probe tester and welding method, etc. The standing wave performance of the microstrip patch antenna is characterized by the vector network analyzer. When the printing pressure is 90 N, the off-screen distance is 2.5 mm, and the printing speed is 90 mm/s, the square resistance of the silver film layer is the lowest and the adhesion is the largest. The silver film with dense structure and good conductivity can be obtained when the sintering temperature is 850 ℃ and the holding time is 15 min. In above situation, the square resistance of the silver film layer is 5.4 mΩ/□ and the adhesion strength of the silver film layer is 2.25 N/mm2. The antenna plate fabricated under above printing and sintering process conditions has a center frequency of 1.869 GHz at room temperature, which is in good agreement with the design center frequency (1.86 GHz). Screen printing process parameters affect the conductivity and adhesion of the film layer by affecting the transfer rate of silver paste during the printing process. The sintering system profoundly affects the compactness of the silver film structure, which in turn affects the conductivity and adhesion of the silver film. Ceramic matrix composite microstrip patch antenna prepared under the printing pressure of 90 N, the off-screen distance of 2.5 mm, the printing speed of 90 mm/s, sintering temperature of 850 ℃ and holding time of 15 min has good standing wave performance.
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