| DING Zhen-yu,LEI Hong.Chemical Mechanical Polishing Performance of Non-Spherical Abrasives on Zirconia Ceramics[J],51(2):306-312, 330 |
| Chemical Mechanical Polishing Performance of Non-Spherical Abrasives on Zirconia Ceramics |
| Received:April 28, 2021 Revised:August 09, 2021 |
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| DOI：10.16490/j.cnki.issn.1001-3660.2022.02.030 |
| KeyWord:non-spherical silica zirconia ceramic backplate chemical mechanical polishing material removal rate surface roughness |
| Author | Institution |
| DING Zhen-yu |
Research Center of Nano Science and Technology, College of Sciences, Shanghai University, Shanghai , China |
| LEI Hong |
Research Center of Nano Science and Technology, College of Sciences, Shanghai University, Shanghai , China |
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| Abstract: |
| The work aims to synthesize new non-spherical silica abrasives and analyze the mechanism of the non-spherical silica abrasives in the polishing process, so as to improve the chemical mechanical polishing performance of the zirconia ceramic backplate of mobile phone. By adjusting the force between spherical silica nano-particles by Zr4+ cations, polishing abrasives with Zr4+ :SiO2 mass ratios of 0, 0.025, 0.050, 0.075, and 0.100 were prepared. Laser particle analyzer and potentiometer and scanning electron microscope (SEM) were used to study the colloidal stability and abrasive grain morphology of polishing slurry. The chemical mechanical polishing performance of abrasives was analyzed from surface roughness (Sa) and material removal rate (MRR). The modified friction coefficient meter and X-ray photoelectron spectroscopy (XPS) were used to reveal the mechanism of the non-spherical silica on zirconia ceramics. The results showed that the well-dispersed non-spherical abrasives silica polishing slurry could be obtained with a relative content of 0.075wt.% of zirconium. Compared with the spherical abrasives silica polishing solution, the MRR of non-spherical silica abrasives was increased by 40.5%, and a smooth surface with Sa of 1.74 nm was obtained. XPS examination showed that silicon dioxide can react with zirconia in a solid phase to produce ZrSiO4, which was easier to be removed during the polishing process. The friction coefficient measurement results showed that the friction coefficient between non-spherical silica abrasives and ceramic wafer was 0.341, which was higher than 0.276 of spherical silica abrasives. The non-spherical silica abrasives can bring a higher coefficient of friction and chemical-mechanical synergy during polishing. It can efficiently remove the surface roughness peaks, obtain a flat surface with nano-level roughness, and realize efficient and high-precision polishing of the zirconia ceramic mobile phone backplane. |
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