| HANG Wei,LING Yang,WEI Lan-qing,ZHANG Xiang,XU Liang,CHEN Hong-yu,YUAN Ju-long.Effect of Sand to Binder Ratio on Lithium Tartate Machining by Fixed-abrasive Plate[J],50(8):382-388, 403 |
| Effect of Sand to Binder Ratio on Lithium Tartate Machining by Fixed-abrasive Plate |
| Received:October 12, 2020 Revised:January 17, 2021 |
| View Full Text View/Add Comment Download reader |
| DOI：10.16490/j.cnki.issn.1001-3660.2021.08.038 |
| KeyWord:fixed-abrasive plate sand to binder ratio lithium tantalate bare abrasive ratio surface roughness material removal rate |
| Author | Institution |
| HANG Wei |
Key Laboratory of Special Purpose Equipment and Advanced Processing Technology of the Ministry of Education, Zhejiang University of Technology, Hangzhou , China |
| LING Yang |
Key Laboratory of Special Purpose Equipment and Advanced Processing Technology of the Ministry of Education, Zhejiang University of Technology, Hangzhou , China |
| WEI Lan-qing |
Key Laboratory of Special Purpose Equipment and Advanced Processing Technology of the Ministry of Education, Zhejiang University of Technology, Hangzhou , China |
| ZHANG Xiang |
Key Laboratory of Special Purpose Equipment and Advanced Processing Technology of the Ministry of Education, Zhejiang University of Technology, Hangzhou , China |
| XU Liang |
Key Laboratory of Special Purpose Equipment and Advanced Processing Technology of the Ministry of Education, Zhejiang University of Technology, Hangzhou , China |
| CHEN Hong-yu |
Key Laboratory of Special Purpose Equipment and Advanced Processing Technology of the Ministry of Education, Zhejiang University of Technology, Hangzhou , China |
| YUAN Ju-long |
Key Laboratory of Special Purpose Equipment and Advanced Processing Technology of the Ministry of Education, Zhejiang University of Technology, Hangzhou , China |
|
| Hits: |
| Download times: |
| Abstract: |
| In order to improve the machining efficiency and surface quality of lithium tantalite wafer, 8000# diamond abrasive and resin bond were used to prepare diamond pellets and then assembled into a fixed-abrasive plate to lapping lithium tantalite. The sand to binder ratio of diamond pellet was analyzed in this experiment, and three kinds of sand to binder ratio of 11∶9, 7∶3 and 17∶3, were set up, and the mass percentage of the corresponding abrasive particles were 55%, 70% and 85%, respectively. A abrasive cell model was established to calculate the ratio between the number of bare abrasives and the total number of abrasives per unit area (Ng/N), the distribution of abrasive particles and binders at different sand to binder ratios and the effect on processing Lithium Tantalum wafers on surface roughness and material removal rate were also analyzed in the experiments. The percentages of abrasive mass of the diamond pellets were 55%, 70% and 85%, and the corresponding bare ratios of abrasive grains were 1.79%, 2.26% and 2.47% respectively. The surface roughness Ra of the wafer after lapping was 4.558 nm, 1.634 nm and 2.999 nm. Compared with the former two, the pellet material removal rate with 85% abrasive mass fraction was the highest, followed by 70%, and 55% was the lowest. It was found that the bare ratio of abrasive particles on the abrasive tool surface increased with the increase of the mass ratio of abrasive particles, and had higher machining efficiency and material removal rate when more bare particles were present on the machined surface. Low abrasive mass ratio resulted in less bare abrasive particles, uneven removal of wafer surface materials, redundant surface, and the poor surface quality, weakensed the trapping effect of resin on abrasive particles by the high abrasive mass ratio, and obvious scratches were produced on the wafer surface after machining. Increasing the sand binder ratio of diamond pellets can effectively improve the bare ratio of abrasive grains on the surface of the pellets, so as to achieve high surface quality and high material removal rate for machining lithium tantalate wafer. However, too high sand binder ratio will lead to surface scratches. |
| Close |
|
|
|