| TAN Xiao-sheng,WANG Chun-xia,CAO Xin-shuai,ZHANG Yu-qing.Effect of AES Surfactant on the Performance of Ethylenediamine Copper Plating[J],50(8):366-374, 403 |
| Effect of AES Surfactant on the Performance of Ethylenediamine Copper Plating |
| Received:October 19, 2020 Revised:December 25, 2020 |
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| DOI：10.16490/j.cnki.issn.1001-3660.2021.08.036 |
| KeyWord:ethylenediamine copper plating AES surfactant compactness micro-morphology nucleation roughness |
| Author | Institution |
| TAN Xiao-sheng |
School of Material Science and Engineering, Nanchang Hangkong University, Nanchang , China |
| WANG Chun-xia |
School of Material Science and Engineering, Nanchang Hangkong University, Nanchang , China |
| CAO Xin-shuai |
School of Material Science and Engineering, Nanchang Hangkong University, Nanchang , China |
| ZHANG Yu-qing |
School of Material Science and Engineering, Nanchang Hangkong University, Nanchang , China |
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| Abstract: |
| This work aims to study the application effect of Fatty Alcohol Polyoxyethylene Ether Sodium Sulfate (AES) in ethylenediamine cyanide-free copper plating, analyze and compare the effect of AES on copper ion deposition, growth and coating performance. In this work, electrochemical workstation was used to analyze the cathodic electrodeposition process, combined with the multifunctional corrosion measuring instrument to obtain the hydrogen permeation curve and the Nyquist curve, then the compactness and corrosion resistance of the coating under different conditions were compared. The microscopic morphology of the surface and cross section of the coating was observed by SEM and metallographic microscope, and XRD was used to analyze the grain orientation, grain size and internal stress of the coating. The result shows that the ethylenediamine copper plating electrodeposition process followed three-dimensional instantaneous nucleation process and was controlled by the diffusion step, and the preferred orientation of the coating crystal was (111) plane, and the surface of the coating obtained without AES introduced were rough, the crystal grains were disordered, and the grains were thorny or granular, with larger internal stress. After AES was introduced into the plating solution, the diffusion coefficient increased, the differential capacitance increased, the cathodic polarization increased, the nucleation potential shifted negatively, and the coating surface were smooth and fine. The proportion of (220) crystal planes reduced from 28.95% to 20.61%, and the roughness reduced from 2.784 μm to 1.814 μm. In addition, the hydrogen permeation curve and EIS test show that after AES was introduced into the plating solution, the ability to block hydrogen penetration of coating was strengthened, the compactness was improved, and the corrosion resistance of coating was also obviously improved. In summary, the introduction of AES surfactant in the ethylenediamine copper plating system has significant effects on improving the microstructure of the coating, reducing burrs, improving the compactness and corrosion resistance of the coating, and can effectively improve the overall performance of the copper coating. |
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