| SUN Zhi,YU Xiao-hui,ZHUANG Zai-yu,ZHAO Jian-wei.Preparation of the Micrometer-scale Silver-coated Copper Powder by Electroless Plating with Replacement Reaction[J],50(5):119-126 |
| Preparation of the Micrometer-scale Silver-coated Copper Powder by Electroless Plating with Replacement Reaction |
| Received:January 14, 2020 Revised:July 31, 2020 |
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| DOI：10.16490/j.cnki.issn.1001-3660.2021.05.012 |
| KeyWord:displacement electroless plating silver-coated copper powder silver loading epoxide resin conductive adhesive |
| Author | Institution |
| SUN Zhi |
College of Materials and Textile Engineering, Jiaxing University, Jiaxing , China |
| YU Xiao-hui |
Jiaxing Ruize Surface Technology Co., Ltd, Jiaxing , China |
| ZHUANG Zai-yu |
College of Materials and Textile Engineering, Jiaxing University, Jiaxing , China |
| ZHAO Jian-wei |
College of Materials and Textile Engineering, Jiaxing University, Jiaxing , China |
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| Abstract: |
| The micrometer-scale silver-coated copper powder was prepared by a novel replacement chemical plating. Compared with the traditional chemical plating, further study on the application of silver coated copper powder in conductive adhesive. By changing the plating solution temperature, a series of silver loading curves from 10 ℃ to 60 ℃ were obtained respectively, from which a series of the rate constants of the replacement reaction at different temperatures were deduced with a theoretical fitting to the surface reaction kinetics. By fitting the Arrhenius equation, the activation energy of replacement reaction was achieved to be 4.1×104 J/mol. The morphology and crystal structure of the silver-coated copper powder were investigated by SEM and XRD, and the surface coverage of the prepared sample was tested by an immersion in a 20% HNO3 solution. It demonstrated that the copper powder can be completely covered by silver while the replacement reaction time is longer than 3 h. The thermogravimetric analysis proved that the silver coating can significantly improve the oxidation resistance of the material. The silver-coated copper powder and epoxy resin prepared at 40 ℃ are used to make 55% conductive adhesive. The results showed that the sample resistance keeps stable at a resistance of less than 0.8 Ω within 40 h baking, although it has a slight increase hereafter due to the thermal diffusion of the copper atoms to the particle surface. The results provided in the present manuscript show great potential in the practical application. |
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