LIU Sai-sai,JIA Wei-ping,WU Meng-hua,QIAN Ning-kai,ZUO Shan-shan.Research on Micro Nickel Column by Electrochemical Deposition Additive Manufacturing Technology[J],50(5):95-101
Research on Micro Nickel Column by Electrochemical Deposition Additive Manufacturing Technology
Received:September 14, 2020  Revised:February 22, 2021
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DOI:10.16490/j.cnki.issn.1001-3660.2021.05.009
KeyWord:additive manufacturing  electrochemical deposition  micro nickel column  interelectrode gap  interelectrode voltage
              
AuthorInstitution
LIU Sai-sai Dalian University, Dalian , China
JIA Wei-ping Dalian University, Dalian , China
WU Meng-hua Dalian University, Dalian , China
QIAN Ning-kai Dalian University, Dalian , China
ZUO Shan-shan Dalian University, Dalian , China
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Abstract:
      The effects of electrodeposition parameters were investigated on the microscopic morphology, diameter and deposition rate of micro nickel column prepared by maskless localized electrodeposition additive manufacturing technology. Micro nickel columns were fabricated on electrochemical deposition experimental platform that a pointed cone-shaped platinum wire is used as the anode and a copper plate is used as the cathode, and the electroplating solution flows to the surface of the cathode in the way of jet flow from the micro gap between the anode and the diversion cavity. Stereo microscope and scanning electron microscope (SEM) were used to detect the microstructure of the nickel column. The influence of interelectrode voltage and initial interelectrode gap on the microscopic morphology, deposition rate and diameter of micro nickel column were studied by single factor experiments. Theresults showed that micro-nickel columns with uniform diameter and high cylindricity can be prepared when the initial electrode spacing was 10μm and the voltage was 3.8~4.4 V, while the micro nickel columns were irregular in shape accompanied by bifurcation or tumor-like deposits when the voltage was increased to 4.7 V. When the electrode voltage increased from 3.8 V to 4.7 V, the deposition rate of micro nickel columns increased from 539 μm3/s to 4159 μm3/s, and the diameter increased from 55 μm to 102 μm. In addition, when the interelectrode voltage was 4.1 V and the initial electrode spacing was 20~40 μm, with the increase of the initial electrode spacing, the tip of the micro-nickel columns were changed from cylindrical to conical deposition. The interelectrode voltage has a significant effect on the microscopic morphology, deposition rate and diameter of the micro-nickel columns, while the initial interelectrode gap mainly affects the deposition shape of the micro-nickel columns.
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