| LI Qi-song,QIAN Hui-xuan,FU Xu,SUN Hai-jing,SUN Jie.Electrodeposition Behaviors and Corrosion Resistance of Copper-Tin Alloy Coating in ChCl-EG Deep Eutectic Solvents[J],50(4):313-318 |
| Electrodeposition Behaviors and Corrosion Resistance of Copper-Tin Alloy Coating in ChCl-EG Deep Eutectic Solvents |
| Received:April 01, 2020 Revised:March 03, 2021 |
| View Full Text View/Add Comment Download reader |
| DOI：10.16490/j.cnki.issn.1001-3660.2021.04.032 |
| KeyWord:deep eutectic solvents copper-tin alloy electrodeposition phase composition corrosion resistance |
| Author | Institution |
| LI Qi-song |
School of Environmental and Chemical Engineering, Shenyang Ligong University, Shenyang , China |
| QIAN Hui-xuan |
School of Environmental and Chemical Engineering, Shenyang Ligong University, Shenyang , China |
| FU Xu |
School of Environmental and Chemical Engineering, Shenyang Ligong University, Shenyang , China |
| SUN Hai-jing |
School of Environmental and Chemical Engineering, Shenyang Ligong University, Shenyang , China |
| SUN Jie |
School of Environmental and Chemical Engineering, Shenyang Ligong University, Shenyang , China |
|
| Hits: |
| Download times: |
| Abstract: |
| The work aims to study the electrochemical behavior, microstructure, phase composition and corrosion resistance of electrodeposited Cu-Sn alloy with different concentration ratio in low eutectic solvent. The cathodic polarization curve was used to study the reduction behavior of copper-tin alloy, the influence of electrode potential on the microstructure of silver coating and the phase composition of silver coating were studied by means of scanning electron microscope (SEM) and X-ray diffraction (XRD), and EDS was used to analyze the element composition of copper-tin alloy coating. The corrosion resistance of Cu-Sn alloy coating was studied by polarization curve. Cu-Sn co-deposition occurs at −0.95 V potential. At this potential, copper exists in alloy form, while tin exists in alloy and elemental form. Electrodeposition system with different metal ion content can obtain different coatings. The content of copper and tin in the plating bath definitely affects the content of copper and tin in the plating bath. In the ChCl-EG deep eutectic solvents, when the content (mol/L) of CuCl2.2H2O and SnCl2.2H2O was 0.192:0.048, 0.192:0.192 and 0.048:0.192, respectively, the phase composition of the obtained coating was β-Cu5.6Sn phase, η-Cu6Sn5 phase and β-Cu5.6Sn phase, and η-Cu6Sn5 phase. As the tin content in the plating solution increased, the phase composition changed from β-Cu5.6Sn phase to η-Cu6Sn5 phase, and the tin phase appeared in the coating. When the copper or tin content in the bath is on the high side, the coating quality is better. The corrosion resistance test showed that the corrosion rate was the lowest when the content of Sn ions in the plating solution was 84.2%, and the corrosion resistance of the coating was optimal under this condition. |
| Close |
|
|
|