| TANG Wei,XIE Wen,ZHANG Jia-yuan.Numerical Study on Residual Stress of Cold Sprayed Mg-alloy Substrate[J],50(1):62-70 |
| Numerical Study on Residual Stress of Cold Sprayed Mg-alloy Substrate |
| Received:April 24, 2020 Revised:December 15, 2020 |
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| DOI：10.16490/j.cnki.issn.1001-3660.2021.01.005 |
| KeyWord:cold spray infinite element layer Mg alloy substrate numerical simulation residual stress |
| Author | Institution |
| TANG Wei |
School of Mechanical Engineering, Xi’an University of Science and Technology, Xi’an , China |
| XIE Wen |
School of Mechanical Engineering, Xi’an University of Science and Technology, Xi’an , China |
| ZHANG Jia-yuan |
School of Mechanical Engineering, Xi’an University of Science and Technology, Xi’an , China |
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| Abstract: |
| ABAQUS/Explicit finite element analysis software was used to study the change trend of residual stress in the process of cold spraying Mg-alloy substrate. With AZ31 as the substrate material and Al-7075 as the particulate material for collision simulation, and an infinite element layer is added to enhance numerical stability, taking into account the effect of multi-particle deposition on the residual stress of the particle deposit substrate. By finite element simulation, the residual stress of the particles increases and decreases with the increase of impact velocity, and finally gradually increases. The stress distribution is symmetrical relative to the center axis, and obvious metal jet phenomenon occurs, and it is found that when the sedimentation velocity is 800 m/s and the incident angle is 90 degrees after incident angle changes, the particle residual stress is maximized, i.e. −2742.72 MPa, but the change of residual stress of the substrate is relatively stable compared to that of the particles during the binding process. Through the study of multi-particle deposition, it is found that after the particle 2 is deposited to particle 1 in about 23 ns, the minimum residual stress of particle 1 is relaxed from −1577.66 MPa to −1099.06 MPa. When particle 3 is deposited to particle 2 in about 53 ns, the minimum residual stress of particle 3 −1152 MPa, which is not much different from that of particle 2. Subsequent particles will also follow this rule. And it is concluded that when a single particle is deposited, the change of the residual stress in the transient shot peening process is relatively severe, and it tends to be stable during the thermal cooling process, which has little effect on the further relief of the residual stress. When multiple particles are deposited, the latter particle can relax the former particle, and at the same time, it can also play a role of compaction, enhance the bonding strength of the coating, and help to form a better coating. |
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