| LIU Yao,LU Bing-hu,FAN Xiao-wei,LI Da-shuang,SHI Hui-juan,DU Peng-kang,ZHANG Yu-song,TAN Yu-hui,TANG Yun-zhi.Deeply Coarsening Surface Treatment of Electrolytic Copper Foil with Sodium Tungstate Composite Additive[J],49(11):168-176 |
| Deeply Coarsening Surface Treatment of Electrolytic Copper Foil with Sodium Tungstate Composite Additive |
| Received:January 06, 2020 Revised:October 17, 2020 |
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| DOI：10.16490/j.cnki.issn.1001-3660.2020.11.018 |
| KeyWord:electrolytic copper foil electrochemistry surface treatment electronic materials morphology roughness |
| Author | Institution |
| LIU Yao |
Jiangxi University of Science and Technology, Ganzhou , China |
| LU Bing-hu |
Anhui Tongguan Copper Foil Co., Ltd, Chizhou , China |
| FAN Xiao-wei |
Jiangxi University of Science and Technology, Ganzhou , China |
| LI Da-shuang |
Anhui Tongguan Copper Foil Co., Ltd, Chizhou , China |
| SHI Hui-juan |
Jiangxi University of Science and Technology, Ganzhou , China |
| DU Peng-kang |
Jiangxi University of Science and Technology, Ganzhou , China |
| ZHANG Yu-song |
Jiangxi University of Science and Technology, Ganzhou , China |
| TAN Yu-hui |
Jiangxi University of Science and Technology, Ganzhou , China |
| TANG Yun-zhi |
Jiangxi University of Science and Technology, Ganzhou , China |
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| Abstract: |
| The work aims to enhance the deeply coarsening effect of electrolytic copper foil. The surface treatment of 35 μm electrolytic copper foils was conducted by electro-deposition method, and the influence of sodium tungstate-HEC-SPS composite additive on surface morphology and performance of electrolytic copper foil was systematically studied by AFM, SEM, XRD, peel strength test, surface roughness test and cyclic voltammetry. The sodium tungstate-HEC-SPS composite additive in the coarsening solution promoted the uniformity and compaction of coarsening coating layer, and improved the effect of deep plating. When the additive amounts of HEC, SPS and sodium tungstate were 5, 50, 60 mg/L respectively, the comprehensive deep plating effect was the best and the roughness Rz and peel strength reached 7.504 μm and 2.139 N/mm separately. The performance indicator was better than that in coarsening sample treatment. The composite additive reduced the reductive spike potential from −0.644 V to −0.674 V, which significantly enhanced the polarization of the electrode. The rate of electro-deposition decreased from 33 μm/h to 29.8 μm/h, which inhibited the deposition effectively. The surface morphology of the nodule on the peak of copper foil peak turned from spininess into smoothness, and was improved obviously. Meanwhile, the preferential orientation of the copper foil coarsening layer accelerated the orientation from (111) and (200) to (220). Adding the sodium tungstate-HEC-SPS composite additive into coarsening solution can significantly enhance the deep plating effect of electrolytic copper foil, improve the peel strength and surface roughness, and promote the preferred orientation (220). |
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