| LIU Min,LING Yang,YUAN Ju-long,HANG Wei.Influence of Ferroelectric Effect on Machining of Lithium Tantalate by Fixed Abrasive Pad[J],49(10):316-323 |
| Influence of Ferroelectric Effect on Machining of Lithium Tantalate by Fixed Abrasive Pad |
| Received:April 30, 2020 Revised:October 20, 2020 |
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| DOI：10.16490/j.cnki.issn.1001-3660.2020.10.037 |
| KeyWord:lithium tantalite fixed abrasive ferroelectric effect surface roughness material removal rate |
| Author | Institution |
| LIU Min |
Key Laboratory of Special Equipment Manufacturing and Advanced Processing Technology of the Ministry of Education, Zhejiang University of Technology, Hangzhou , China |
| LING Yang |
Key Laboratory of Special Equipment Manufacturing and Advanced Processing Technology of the Ministry of Education, Zhejiang University of Technology, Hangzhou , China |
| YUAN Ju-long |
Key Laboratory of Special Equipment Manufacturing and Advanced Processing Technology of the Ministry of Education, Zhejiang University of Technology, Hangzhou , China |
| HANG Wei |
Key Laboratory of Special Equipment Manufacturing and Advanced Processing Technology of the Ministry of Education, Zhejiang University of Technology, Hangzhou , China |
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| Abstract: |
| The work aims to study the potential influence of ferroelectric effect on machining of lithium tantalate. The pellets made of 3000# diamond powder were selected and consolidated in the designed fixture to make a new type of fixed abrasive pad. The lapping results of free abrasive and fixed abrasive pad on lithium tantalate were compared and discussed. Then, the constant temperature water bath device was used to control the coolant at a low temperature in the experiment, and elec?trolyte solution was added to further analyze the influence of ferroelectric effect on the results of the processing of lithium tantalate by the fixed abrasive pad with material removal rate, surface morphology, and roughness as indicators. After lapping for 10 minutes, the surface roughness of LT wafer reduced from 419.112 nm to 232.319 nm, and the material removal rate was 36.78 μm/h. Abrasive embedding, deep scratches, and a large number of pits appeared on the surface of workpiece, and the LT wafer broke easily during grinding. Under the same processing conditions, the surface roughness of the fixed abrasive pad reduced from 419.112 nm to 97.004 nm, and the material removal rate was 57.19 μm/h. Compared with lapping results of free abrasive pad, the abrasive embedding was extremely less, the depth of scratches became shallow, the number of pits decreased, and the surface was smoother. When the coolant temperature was 5 ℃ and electrolyte solution with a concentration of 0.5% was added, the surface roughness Sa reduced to 37.943 nm after lapping with a fixed abrasive pad for 10 minutes, and the average material removal rate was 58.75 μm/h. There were only some slight scratches on the surface of workpiece, without embedded abrasive particles and deep pits. Under the same conditions, the surface after ground with fixed abrasive pad has lower rough?ness, better quality, higher removal rate and more excellent machining efficiency and yield than that ground with free abrasive pad. Low temperature and electrolyte solution can effectively inhibit the physical properties of lithium tantalate, prevent the occ?ur?rence and propagation of cracks, improve the surface damage of the wafer, and further increase the surface quality of the wafer. |
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