ZHENG Yue-hong,ZHANG Na,LI Xiao-na,LI Zhu-min,DONG Chuang,LA Pei-qing.Nitrogenous Copper Alloy Thin Films Based on Stable Solid Solution Cluster Model[J],49(5):75-80
Nitrogenous Copper Alloy Thin Films Based on Stable Solid Solution Cluster Model
Received:February 15, 2020  Revised:May 20, 2020
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DOI:10.16490/j.cnki.issn.1001-3660.2020.05.009
KeyWord:copper alloy  magnetron sputtering  alloy thin film  cluster model  hardness  electrical resistivity
                 
AuthorInstitution
ZHENG Yue-hong 1.State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou , China; 2.Key Laboratory of Materials Modification by Laser, Ion and Electron Beam, Ministry of Education, Dalian University of Technology, Dalian , China
ZHANG Na 1.State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou , China
LI Xiao-na 2.Key Laboratory of Materials Modification by Laser, Ion and Electron Beam, Ministry of Education, Dalian University of Technology, Dalian , China
LI Zhu-min 2.Key Laboratory of Materials Modification by Laser, Ion and Electron Beam, Ministry of Education, Dalian University of Technology, Dalian , China
DONG Chuang 2.Key Laboratory of Materials Modification by Laser, Ion and Electron Beam, Ministry of Education, Dalian University of Technology, Dalian , China
LA Pei-qing 1.State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou , China
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Abstract:
      In order to prepare nitrogen-containing copper alloy films with stable structure and performance, and then improve the hardness of copper alloys, the relatively large negative mixing enthalpy between Nb and N and the effect of Ni were utilized to bring N into Cu to achieve the purpose of stable existence of N, which based on previous research of the stable solid solution cluster model in the composition design of Cu-Ni-based copper alloys. Cu-Ni-Nb-N quaternary alloy thin films and reference samples were prepared by magnetron sputtering on Si (100) substrates in an atmosphere where the N2/Ar ratio was 1/30. Then the composition, structure and film-substrate interface of films were analyzed by EPMA, XRD and TEM, respectively, and the resistivity and hardness was measured by double-electric four-probe instrument and super-light-load Nodule hardness tester. Compared with Cu(N) films, quaternary alloy films exhibit better structural stability and higher hardness. The as-deposited quaternary thin films are composed of nanoscale columnar crystals of copper and a small amount of NbN, and their hardness values are about 5 GPa. After annealing at 550 ℃ for 1 h, the films show good densification, part of N can exist stably in the form of NbN compound, the hardness of most of the films is above 3 GPa, simultaneously, these films exhibit good conductivity. Therefore, the stable solid solution cluster model can be used to select the nitrogen fixation elements, and the nitrogen-containing copper alloy films with good comprehensive performance can be prepared, which lays a foundation for their further application in the surface modification of copper and its alloys.
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