| XIONG Lin-li,LI Xue-ming,WANG Tao,XU Ke.Electromagnetic Shielding Fabric of Nylon 66 Composite Plating[J],49(1):180-186 |
| Electromagnetic Shielding Fabric of Nylon 66 Composite Plating |
| Received:February 21, 2019 Revised:January 20, 2020 |
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| DOI：10.16490/j.cnki.issn.1001-3660.2020.01.021 |
| KeyWord:etching electroless copper plating composite plating electromagnetic shielding Nylon 66 fabric |
| Author | Institution |
| XIONG Lin-li |
Chongqing University, Chongqing , China |
| LI Xue-ming |
Chongqing University, Chongqing , China |
| WANG Tao |
Chongqing University, Chongqing , China |
| XU Ke |
Chongqing University, Chongqing , China |
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| Abstract: |
| The aim of this research is to explore the best etching process for electroless plating, optimize the sodium hypophosphite electroless copper plating process and compare the effects of electroless nickel-copper plating and electroless copper- nickel plating under the same process conditions on the electromagnetic shielding effectiveness of fabric. The electroless nickel plating of nylon 66 after being roughed by dilute hydrochloric acid/acetic acid aqueous solution and dilute hydrochloric acid/acetic acid ethanol solution was observed for effect with SEM to compare the two kinds of etching schemes. The copper plating deposition rate and weight loss rate were used to reflect the effect of the electroless plating to explore the optimal copper plating formula and determine the optimum process conditions for electroless copper plating of sodium hypophosphite. The electromagnetic shielding properties of electroless nickel plating, electroless copper plating, electroless copper plating after nickel plating and electroless nickel plating after copper plating were tested through the flange coaxial test method. After being coarsened with the crude hydrochloric acid/acetic acid aqueous solution, the fabric coating layer was easy to fall off, and the plating coarsended with diluted hydrochloric acid/acetic acid aqueous solution had strong adhesive force. The best copper plating process with sodium hypophosphite as reducing agent was copper sulfate 20 g/L, nickel sulfate 8 g/L, sodium hypophosphite 70 g/L, boric acid 35 g/L, pH 10.2~10.6, time 20 min, temperature 75 ℃. Electroless nickel plating after electroless copper plating gave a fabric shielding effectiveness of 70 dB. The plating treated with dilute hydrochloric acid/acetic acid aqueous solution. The plating obtained by electroless nickel plating is an amorphous substance, and the electroless copper plating of sodium hypophosphite is a crystalline substance. After electroless copper plating, the nickel-plated fabric is more densely plated. Under the same process conditions, the weight gain rate of electroless copper-nickel plating is greater than that of electroless nickel-copper plating, and the electroless copper-nickel shielding effect is superior to electroless copper plating and electroless nickel-copper plating. |
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