| WU Yu-hou,WANG Hao,LI Song-hua,SUN Jian,WANG He.Grinding Thermal Characteristics and Surface Forming Mechanism of Silicon Nitride Ceramics[J],48(12):360-368 |
| Grinding Thermal Characteristics and Surface Forming Mechanism of Silicon Nitride Ceramics |
| Received:May 18, 2019 Revised:December 20, 2019 |
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| DOI：10.16490/j.cnki.issn.1001-3660.2019.12.044 |
| KeyWord:heat distribution ratio grinding temperature roughness removal method crack constant speed ratio |
| Author | Institution |
| WU Yu-hou |
a.National-Local Joint Engineering Laboratory of NC Machining Equipment and Technology of High-Grade Stone, Shenyang Jianzhu University, Shenyang , China |
| WANG Hao |
b.School of Mechanical Engineering, Shenyang Jianzhu University, Shenyang , China |
| LI Song-hua |
a.National-Local Joint Engineering Laboratory of NC Machining Equipment and Technology of High-Grade Stone, b.School of Mechanical Engineering, Shenyang Jianzhu University, Shenyang , China |
| SUN Jian |
b.School of Mechanical Engineering, Shenyang Jianzhu University, Shenyang , China |
| WANG He |
a.National-Local Joint Engineering Laboratory of NC Machining Equipment and Technology of High-Grade Stone, Shenyang Jianzhu University, Shenyang , China |
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| Abstract: |
| The work aims to investigate the effect of grinding thermal and thermal properties of silicon nitride ceramics on surface formation. Firstly, the heat distribution ratio formula of the incoming workpiece, grinding chip and grinding wheel were obtained by the inverse method. Secondly, the relationship between grinding parameters and grinding temperature and heat distribution ratio were obtained by K-type thermocouple and dynamometer. Finally, the temperature range of the optimal grinding quality was found through the detection of grinding surface morphology and roughness. The results showed that when the grinding wheel speed was increased from 25 m/s to 50 m/s, the grinding temperature was increased from 256 ℃ to 819 ℃ and the heat distribution ratio of the incoming grinding wheel, workpiece and grinding chip were changed from 82.4% to 64.4%, 12.1% to 24.3% and 5.5% to 11.3%. When the grinding depth was increased from 5 μm to 30 μm, the grinding temperature was increased from 289 ℃ to 869 ℃ and the heat distribution ratio of the incoming grinding wheel, workpiece and grinding chip were changed from 76.1% to 53.9%, 17.3% to 30.3% and 6.6% to 15.8%. When the workpiece feed rate was increased from 2000 mm/min to 7000 mm/min, the grinding temperature was reduced from 772 ℃ to 513 ℃ and the heat distribution ratio of the incoming grinding wheel, workpiece and grinding chip were changed from 71.1% to 78.3%, 21.1% to 11.7% and 5.8% to 10.1%. As the grinding temperature increased from 256 ℃ to 869 ℃, the surface roughness first decreased from 0.2708 μm to 0.2472 μm and then increased to 0.3182 μm. Grinding with constant speed ratio could reduce the grinding temperature by 25~127 ℃, and decrease the heat distribution ratio of the incoming workpiece. Proper high temperature is beneficial to the formation of surface plastic deformation and the improvement of surface quality. However, too high temperature will form hot cracks. The surface quality is the best between 489~662 ℃. While the grinding wheel speed increases, the feed rate can be appropriately increased to reduce the grinding temperature, decrease the heat transferred into the workpiece and increase the grinding efficiency. |
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