| HUANG Sheng,HANG Wei,CHEN Zhi-xiang,YUAN Ju-long,ZHAO Ping,Duc-Nam Nguyen.Effect of Surface Roughness of Stainless-steel Substrate on Water-film Adhesion[J],48(9):97-103 |
| Effect of Surface Roughness of Stainless-steel Substrate on Water-film Adhesion |
| Received:February 23, 2019 Revised:September 20, 2019 |
| View Full Text View/Add Comment Download reader |
| DOI：10.16490/j.cnki.issn.1001-3660.2019.09.009 |
| KeyWord:stainless steel water film adsorption hydrophilicity roughness friction coefficient |
| Author | Institution |
| HUANG Sheng |
1.Key Laboratory of Special Equipment Manufacturing and Advanced Processing Technology of Ministry of Education, Zhejiang University of Technology, Hangzhou , China |
| HANG Wei |
1.Key Laboratory of Special Equipment Manufacturing and Advanced Processing Technology of Ministry of Education, Zhejiang University of Technology, Hangzhou , China |
| CHEN Zhi-xiang |
1.Key Laboratory of Special Equipment Manufacturing and Advanced Processing Technology of Ministry of Education, Zhejiang University of Technology, Hangzhou , China |
| YUAN Ju-long |
1.Key Laboratory of Special Equipment Manufacturing and Advanced Processing Technology of Ministry of Education, Zhejiang University of Technology, Hangzhou , China |
| ZHAO Ping |
1.Key Laboratory of Special Equipment Manufacturing and Advanced Processing Technology of Ministry of Education, Zhejiang University of Technology, Hangzhou , China |
| Duc-Nam Nguyen |
2.Ho Chi Minh City University of Technology, Ho Chi Ming City , Vietnam |
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| Abstract: |
| The work aims to treat the surface of the stainless-steel substrate to different roughness from the functional study of water film adhesion and measure the effect of different substrates on adhesion force and tangential friction force of sapphire wafer, so as to obtain the effect laws of roughness on the adhesion effect of the water film. Stainless-steel substrates with different roughness (Sa=633.4, 332.6, 116.2, 64.5, 41.4 nm) were obtained by sanding, grinding, polishing. The contact angle meter was used to photograph the static contact angle formed by the droplets on the surface of the substrate and then obtain the wetting properties of the stainless-steel surfaces with different roughness. A high-precision multi-dimensional force measurement platform was developed and designed to measure the adsorption force and tangential force of the sapphire wafer after wetting, and compare the measurement results with that of the unwetted substrate. Finally, the effect of roughness on adsorption coefficient and friction coefficient was obtained. The static contact angles of the five stainless steel substrates with different roughness were all less than 90°, which were all hydrophilic. Under the adsorption condition of water film, the adsorption force decreased with the increase of roughness, the contact angle increased with the increase of roughness, and the decrease rate of adsorption force was similar to the increase rate of contact angle. The coefficient of friction increased as the roughness increased. When the roughness of the substrate was large, the water film could provide certain adhesion which made the tangential force of friction under adsorption of water film larger than that of unwetted film. When the surface roughness of the substrate was small, the water film was more likely used for lubrication, so the tangential force of friction was much smaller than that of unwetted film. When the substrate roughness is smaller, the substrate can provide more adsorption, but the friction is not as large as that of unwetted film. When the substrate roughness is larger, the adsorption is relative weak, but the friction is larger than that of the unwetted film. When the stainless-steel substrate is selected as the water film adsorption substrate, under the condition of ensuring sufficient adsorption force, the surface roughness of the substrate can be appropriately increased to resist the frictional force of the polishing pad during the wafer polishing process. |
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