YIN Lu,XU Da-ke,YANG Chun-guang,XI Tong,LI Zhong,ZHAO Ying,YANG Ke.Effect of Cu and Ag on Microbiologically Influenced Corrosion Resistance of 2205 Duplex Stainless Steel in Sulfate Reducing Bacteria[J],48(7):316-323
Effect of Cu and Ag on Microbiologically Influenced Corrosion Resistance of 2205 Duplex Stainless Steel in Sulfate Reducing Bacteria
Received:November 21, 2018  Revised:July 20, 2019
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DOI:10.16490/j.cnki.issn.1001-3660.2019.07.036
KeyWord:microbiologically induced corrosion (MIC)  antibacterial stainless steel  sulfate-reducing bacteria (SRB)  syn-ergistic antibacterial effect  biofilm  passive film
                    
AuthorInstitution
YIN Lu 1.Institute of Metal Research, Chinese Academy of Sciences, Shenyang , China; 2.School of Materials Science and Engineering, University of Science and Technology of China, Hefei , China
XU Da-ke 3.Northeastern University, Shenyang , China
YANG Chun-guang 1.Institute of Metal Research, Chinese Academy of Sciences, Shenyang , China
XI Tong 1.Institute of Metal Research, Chinese Academy of Sciences, Shenyang , China
LI Zhong 3.Northeastern University, Shenyang , China
ZHAO Ying 4. Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen , China
YANG Ke 1.Institute of Metal Research, Chinese Academy of Sciences, Shenyang , China
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Abstract:
      The work aims to provide 2205 duplex stainless steel (DSS) with synergistic antibacterial effect by adding Cu and Ag elements to enhance the antibacterial property and resistance to microbiologically influenced corrosion of materials. The in-fluence of Cu and Ag on the microstructure variations and proportion of two phases of materials was investigated by optical mi-croscopy (OM) and scanning electron microscopy (SEM). Furthermore, energy-dispersive X-ray spectrometer (EDS) was used to analyze the elements distribution. Electrochemical tests including potentiodynamic polarization, open circuit potential (OCP), liner polarization (LPR) and electrochemical impedance spectroscopy (EIS) were adopted to characterize the change in corrosion resistance of materials and the resistance to microbiologically influenced corrosion of materials after added with Cu and Ag in sulfate reducing bacteria (SRB). Mott-Schottky tests were used to study the corrosion resistance and passive films stability of specimens. The biofilm and corrosion products were observed by SEM and the main components of corrosion products were an-alyzed by EDS. Confocal laser scanning microscopy (CLSM) was applied to observe the growth of bacteria in the biofilm on the surface after lipid detection so as to investigate the synergistic antibacterial effect of Cu and Ag-containing materials. Addition of Cu increased the amount of α phase in the 2205 DSS. Ag element was mainly distributed in the matrix material in Ag enriched phase. Electrochemical results showed that the passive current density (Jp) and self-corrosion current density (Jcorr) of 2205 DSS were 1.19 μA/cm2 and 10.30 mA/cm2, respectively. For 2205-Cu and 2205-Cu-Ag DSS, the self-corrosion current density (Jcorr) was 13.73 mA/cm2 and 28.85 mA/cm2, respectively and the passive current density (Jp) was 1.54 μA/cm2 and 2.31 μA/cm2 respectively. The addition of Cu and Ag could increase the self-corrosion current density and passive current density. Correspondingly, addition of Cu and Ag obviously increased the doping density of passive film and the values of doping density were 2.81×1020 cm-3 for 2205 DSS, 4.46×1020 cm-3 for 2205-Cu DSS and 4.97×1020 cm-3 for 2205-Cu-Ag DSS, respectively. However, in culture medium containing SRB, the Rp value of 2205-Cu-Ag DSS was much higher than that of 2205-Cu and 2205 DSS because of the synergistic antibacterial effect of Cu and Ag. After 14 days of incubation, the Rp values of 2205, 2205-Cu and 2205-Cu-Ag were 37.27 kΩ•cm2, 41.51 kΩ•cm2 and 72.90 kΩ•cm2, respectively. The surface of 2205-Cu-Ag showed less corrosion products, sparse biofilm and more dead bacteria than 2205 and 2205-Cu samples by through lipid detection and scanning electron microscope images. Addition of Cu and Ag elements into 2205 DSS can change the phase ratio and reduce the corrosion resistance to some degree and the density of passive film. However, at the same time, the Ag-containing material has obvious synergistic antibacterial effect, can effectively inhibit the adhesion of biofilm on the metal surface, and obviously improves the resistance of the material to microbiologically induced corrosion caused by sulfate reducing bacteria.
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