| LI Sha,WANG Kai-lin.Simulation and Experimental Analysis of Ultrasonic Vibration Assisted Creep Feed Grinding Temperature Field[J],47(7):265-269 |
| Simulation and Experimental Analysis of Ultrasonic Vibration Assisted Creep Feed Grinding Temperature Field |
| Received:January 08, 2018 Revised:July 20, 2018 |
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| DOI：10.16490/j.cnki.issn.1001-3660.2018.07.040 |
| KeyWord:ultrasonic vibration creep feed grinding temperature field heat source model heat source strength finite element simulation |
| Author | Institution |
| LI Sha |
University of Shanghai for Science and Technology, Shanghai , China |
| WANG Kai-lin |
University of Shanghai for Science and Technology, Shanghai , China |
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| Abstract: |
| The work aims to verify the effects of ultrasonic vibration on grinding heat and provide basis for further studying grinding mechanism by comparatively studying temperature change of grinding workpiece surface due to ultrasonic vibration assisted creep feed in grinding process. Based on analytical model of grinding temperature field, average strength of grinding heat sourcewas established. Surface temperature field of workpiece was simulated for common creep feed grinding and ultrasonic assisted creep feed grinding, respectively by using ANSYS thermal analysis module. Temperature field distribution and temperature-time curve of workpiece surface were obtained in different load step, which accurately reflected temperature change of workpiece surface. The experiments and simulation showed that the workpiece surface temperature of creep feed grinding was higher during creep feed of grinding workpiece. Ultrasonic vibration could effectively reduce grinding force, reduce heat generated during grinding, and reduce the surface temperature of workpiece by about 20%. In case of ultrasonic vibration-assisted grinding workpiece, abrasive grain contacts workpiece discontinuously due to high-frequency vibration of workpiece, hence the grinding process becomes orderly pulsed intermittent grinding, which facilitates workpiece radiation, reduces grinding temperature, and provides technical support for avoiding grinding burn phenomenon which may easily occur during creep feed grinding. |
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