| HONG Bo,PAN Ying-jun,ZHANG Heng,ZHANG Yang.Plating Nickel Film on Molybdenum Alloy by Magnetron Sputtering and Follow-up Heat Treatment[J],44(9):23-28 |
| Plating Nickel Film on Molybdenum Alloy by Magnetron Sputtering and Follow-up Heat Treatment |
| Received:April 21, 2015 Revised:September 20, 2015 |
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| DOI：10.16490/j.cnki.issn.1001-3660.2015.09.005 |
| KeyWord:magnetron sputtering nickel film deposition rate adhesion heat treatment |
| Author | Institution |
| HONG Bo |
Wuhan University of Science and Technology, Wuhan , China |
| PAN Ying-jun |
Wuhan University of Science and Technology, Wuhan , China |
| ZHANG Heng |
Wuhan University of Science and Technology, Wuhan , China |
| ZHANG Yang |
Wuhan University of Science and Technology, Wuhan , China |
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| Abstract: |
| Objective To optimize the process of plating nickel film on molybdenum disc substrates by direct current magnetron sputtering, and research the follow-up heat treatment. Methods Though designing an orthogonal experiment scheme, the effects of sputtering power, sputtering pressure, bias voltage and deposition time on deposition rate and adhesion of nickel film were researched. The organization and structure of nickel film prepared with the optimal parameters were characterized by scanning electron microscope and flatness tester. And the effect of follow-up heat treatment on adhesion of nickel film was also researched. Results The results showed that the primary and secondary order of the effects of the parameters on the deposition rate was: sputtering power, sputtering pressure and then bias voltage. The primary and secondary order of the effects of the parameters on the adhesion was: bias voltage, deposition rate, sputtering power, and then sputtering pressure. With increasing sputtering power, the deposition rate increased and the film adhesion increased at first and then decreased. With increasing deposition time, the deposition rate and film adhesion both increased at first and then decreased. Negative bias had little effect on the deposition rate, but it was beneficial for improving the adhesion of the film. And the film adhesion decreased with the increase of deposition time. The follow-up heat treatment of 1 h incubation at 850 ℃ in hydrogen atmosphere could obviously increase the film adhesion by promoting the formation of the diffusion layer. Conclusion The optimal process parameters of plating nickel film were: sputtering power 1. 8 kW, sputtering pressure 0. 3 Pa, bias voltage 450 V,deposition time 10 min. The thickness of th film was about 1. 15 μm. The film and substrate bounded tightly, and the surface of film was smooth, continuous and dense. The follow-up heat treatment was an effective method to improve the adhesion of nickel film. |
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