| LIU Yong-yong,LIU Tao-tao,CHEN Yue-hua,YUAN Li-hua,JIANG De-feng,ZHU Jun-hao.Solderability of a Kind of a Semi-bright Nickel Plating Process[J],44(7):23-26 |
| Solderability of a Kind of a Semi-bright Nickel Plating Process |
| Received:January 24, 2015 Revised:July 20, 2015 |
| View Full Text View/Add Comment Download reader |
| DOI：10.16490/j.cnki.issn.1001-3660.2015.07.005 |
| KeyWord:nikel plating solderability reflow soldering packaging integrated circuit packages quality of coating |
| Author | Institution |
| LIU Yong-yong |
Chongqing Photoelectric Technology Institute, Chongqing , China |
| LIU Tao-tao |
Southwest Technology and Engineering Research Institute, Chongqing , China |
| CHEN Yue-hua |
Chongqing Photoelectric Technology Institute, Chongqing , China |
| YUAN Li-hua |
Chongqing Photoelectric Technology Institute, Chongqing , China |
| JIANG De-feng |
Chongqing Photoelectric Technology Institute, Chongqing , China |
| ZHU Jun-hao |
Chongqing Photoelectric Technology Institute, Chongqing , China |
|
| Hits: |
| Download times: |
| Abstract: |
| Objective To solve the problem of poor solderability of nickel plating layer, make the solderability of the optoelectronic device shell meet the requirements of reflow soldering and guarantee the solderability not to reduce after storage for half a year. Methods Taking nickel amino-sulfonate as a system, this paper investigated the relationship among temperature, pH, current density and deposition rate by adopting the reflow soldering and Tin dipping method to characterize the solderability of the coating and investigated the coating quality, bonding force and performance metrics in the salt spray test. Results The plating solution system can obtain a plating layer with good solderability within broader ranges of current density and temperature. The deposition rate increased as a linear with the increasing current density and the solderability was proved good. The infiltrating and reflow soldering experiments showed that the solderability of the plating layer all met the requirements in the 45 ℃ steady-state humid environment (95% RH for 48 h) or under the condition of constant baking at 150 ℃ for 1 hour. Conclusion When the current density is between 1 A/ dm2 and 5 A/ dm2, pH is 3. 2 to 4. 4 and the temperature control is between 40 ℃ and 55 ℃, the excellent solderability of plating layer can be obtained and meet the requirements of reflow soldering on the solderability of plating layer and can be kept for half a year with no reduction. |
| Close |
|
|
|