FENG Lei,XU Bi,CAI Zai-sheng.Preparation and Properties of Conductive,Superhydrophobic and Oleophobic Polyester Fabrics[J],44(5):91-95
Preparation and Properties of Conductive,Superhydrophobic and Oleophobic Polyester Fabrics
Received:January 08, 2015  Revised:May 20, 2015
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DOI:10.16490/j.cnki.issn.1001-3660.2015.05.017
KeyWord:chemical plating  chemical vapor deposition  amphiphobicity  electric conduction
        
AuthorInstitution
FENG Lei Key Laboratory of Textile Fabric Technology, Ministry of Education, Donghua University, Shanghai , China
XU Bi Key Laboratory of Textile Fabric Technology, Ministry of Education, Donghua University, Shanghai , China
CAI Zai-sheng Key Laboratory of Textile Fabric Technology, Ministry of Education, Donghua University, Shanghai , China
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Abstract:
      Objective To prepare superhydrophobic and oleophobic textile fabrics with good conductive property. Methods The surface of polyester fabric was first coated with copper using the chemical copper-plating method to build a micron-submicron structure. Then the superhydrophobic and oleophobic conductive fabrics were fabricated through chemical vapor deposition of 1H,1H, 2H,2H-perfluorooctyltrimethoxysilane (PFTMS) to generate a layer of low surface energy group on the surface of the Cu-planted polyester fabrics. The properties of amphiphobic polyester fabrics including surface morphology, element distribution, amphiphobicity and electrical conductivity were investigated with scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDXS), contact angle tester and square resistance tester. Results It showed that the PFTMS-Cu-modified polyester fabrics had outstanding conductive capability, the sheet resistance was about 230 mΩ, and the resistance to UV performance was up to 50+. The contact angles of the modified polyester fabrics with water and n-hexadecane were 152. 0° and 120. 7°, respectively. Conclusion Superhydrophobic and oleophobic fabrics with good conductive property could be successfully fabricated using PFTMS by chemical copper-plating and chemical vapor deposition method.
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