LI Hui-qin,CHEN Xiao-yong,WANG Cheng,MU Ji-liang,XU Zhuo,YANG Jie,CHOU Xiu-jian,XUE Chen-yang,LIU Jun.Progress in Application Research of Atomic Layer Deposition in Micro-nano Devices Field[J],44(2):60-67
Progress in Application Research of Atomic Layer Deposition in Micro-nano Devices Field
Received:December 08, 2014  Revised:February 20, 2015
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DOI:10.16490/j.cnki.issn.1001-3660.2015.02.012
KeyWord:atomic layer deposition  thin-film preparation technology  high aspect-ratio structure  nano-porous structure  micro-nano structure devices
                          
AuthorInstitution
LI Hui-qin 1. Key Laboratory of Instrumentation Science & Dynamic Measurement Ministry of Education,North University of China, Taiyuan , China; 2. Key Laboratory of Science and Technology on Electronic Test & Measurement, North University of China, Taiyuan , China
CHEN Xiao-yong 1. Key Laboratory of Instrumentation Science & Dynamic Measurement Ministry of Education,North University of China, Taiyuan , China; 2. Key Laboratory of Science and Technology on Electronic Test & Measurement, North University of China, Taiyuan , China
WANG Cheng 1. Key Laboratory of Instrumentation Science & Dynamic Measurement Ministry of Education,North University of China, Taiyuan , China; 2. Key Laboratory of Science and Technology on Electronic Test & Measurement, North University of China, Taiyuan , China
MU Ji-liang 1. Key Laboratory of Instrumentation Science & Dynamic Measurement Ministry of Education,North University of China, Taiyuan , China; 2. Key Laboratory of Science and Technology on Electronic Test & Measurement, North University of China, Taiyuan , China
XU Zhuo Key Laboratory of Instrumentation Science & Dynamic Measurement Ministry of Education,North University of China, Taiyuan , China;
YANG Jie Key Laboratory of Science and Technology on Electronic Test & Measurement, North University of China, Taiyuan , China
CHOU Xiu-jian 1. Key Laboratory of Instrumentation Science & Dynamic Measurement Ministry of Education,North University of China, Taiyuan , China; 2. Key Laboratory of Science and Technology on Electronic Test & Measurement, North University of China, Taiyuan , China
XUE Chen-yang 1. Key Laboratory of Instrumentation Science & Dynamic Measurement Ministry of Education,North University of China, Taiyuan , China; 2. Key Laboratory of Science and Technology on Electronic Test & Measurement, North University of China, Taiyuan , China
LIU Jun 1. Key Laboratory of Instrumentation Science & Dynamic Measurement Ministry of Education,North University of China, Taiyuan , China; 2. Key Laboratory of Science and Technology on Electronic Test & Measurement, North University of China, Taiyuan , China
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Abstract:
      Atomic layer deposition (ALD) is a new type of accurate surface thin film preparation technique, which has several characteristics such as depositing large-area uniform films, making the film thickness control at nanometer level feasible, and lower deposition temperature. This new technique is suitable for the complicated nano-porous and high aspect ratio substrate materials, and can be applied in the preparation of functional film materials for 3D micro-nano devices. Now great attention of widespread academic and industry has been paid to ALD technology. The development history and related working principles of ALD technology were reviewed in this paper. Especially, the application progress of ALD technique in the micro-nano devices, including semiconductor integrated circuit, micro and nano optics and biomedical field, was introduced in the paper. Meanwhile, the existing problems of ALD technique and its future development tendency were discussed.
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