| YANG Yu-fang,ZHONG Ming-hua,HUANG Jun-sheng.Dynamic Characteristics of Electroless Tin Plating Reaction[J],43(6):64-68 |
| Dynamic Characteristics of Electroless Tin Plating Reaction |
| Received:July 08, 2014 Revised:December 10, 2014 |
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| KeyWord:electroless plating reaction order kinetics |
| Author | Institution |
| YANG Yu-fang |
Department of Chemistry, Hanshan Normal University, Chaozhou , China |
| ZHONG Ming-hua |
Department of Chemistry, Hanshan Normal University, Chaozhou , China |
| HUANG Jun-sheng |
Department of Chemistry, Hanshan Normal University, Chaozhou , China |
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| Abstract: |
| Objective To study the dynamic characteristics of electroless tin plating reaction. Methods Using sodium hypophosphite as the reducing agent, and SnCl2 as the main salt, electroless Sn was deposited on copper in the thiourea-citric acid-tartaric acid trinary ligand system. Influences of temperature, as well as the concentrations of main salt, reducing agent, hydrogenion and complexing agents on the deposition rate were investigated, respectively. Results The reaction orders of Sn2+, sodium hypophosphite and H+ were 0. 302, 0. 192 and 0. 21,and those of thiourea, citric acid and tartaric acid were 0. 237, 0. 213 and 0. 081, respectively. The rate constant was 0. 013, the total reaction order was 1. 235, and the apparent activation energy was 11. 184 kJ/ mol. Conclusion The kinetic equation of electroless tin plating reaction was established, which provides reference for the technology selection and product control in electroless tin deposition technology. |
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