CHONG Fa-li.Parameter Optimization of Texture of Crystalline Silicon Wafers[J],43(5):87-90 |
Parameter Optimization of Texture of Crystalline Silicon Wafers |
Received:April 17, 2014 Revised:June 16, 2014 |
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KeyWord:monocrystalline silicon texturization reflectance |
Author | Institution |
CHONG Fa-li |
Xuzhou Institute of Technology, Xuzhou , China |
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Abstract: |
Objective To study the effect of the mixture solution of NaOH, HF and HNO3 on the texture of crystalline silicon wafers. Methods The monocrystalline silicon wafer was corroded by changing NaOH concentration, isopropyl alcohol ( IPA) concentration and corrosion time. The polycrystalline silicon wafer ( Poly-Si) was corroded by changing the concentration of acid solution. The texture was analyzed by means of the SEM images and the surface reflectance of silicon. Results The optimum corrosion parameters were 15 g/L for NaOH, 15% ~ 20% for IPA volume fraction, 10 minutes for corrosion time at 80 ℃ for thermokalite. At these optimized parameters, the size of pyramids was even with height of about 5 μm. The adjacent pyramids were linked to each other and the surface reflectance of silicon was reduced to 15% . The corrosion rate was 2 μm/min at the mixture solution of V( HF) : V( HNO3 ) : V( CH3 COOH) = 10 : 1 : 10, and the texture showed like ravine. Conclusion The acid-base property of the solution and the addition of IPA have significant influence on the texture of crystalline silicon and directly affect the surface reflectance of silicon. |
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