| FAN Ai-zhen.Simulation Analysis of Copper Electroplating of Inductor Coils Based on Finite Element[J],43(5):25-28,65 |
| Simulation Analysis of Copper Electroplating of Inductor Coils Based on Finite Element |
| Received:May 04, 2014 Revised:June 21, 2014 |
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| DOI： |
| KeyWord:plating kinetics moving mesh computer simulation plating model |
| Author | Institution |
| FAN Ai-zhen |
Shaanxi Industrial Vocational College, Xianyang , China |
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| Abstract: |
| Objective To optimize the electroplating process of the inductor coil and study the current distribution, the electrolyte potential and the coating thickness distribution during the electroplating process of the inductor coil. Methods The computer simulation technology was used to build a three-dimensional inductor coil plating model with regards to parameterized coil turns based on plating kinetics, electrochemistry theory, Faraday theorem, and moving mesh model. Results The external part of inductor had a high copper concentration of about 309 mol/m3 ; the outermost plating inductor coil had the highest thickness of about 7. 3141 μm; the larger current in the external coil resulted in a larger plating deposition rate for the outer coil. Conclusion The mass transfer of electrolytic copper ion has the main effect on the plating kinetics. The plating thickness interacts with the current distribution on the active plating surface. The plating model can be used to analyze the impact of different plating turns on the plating process, the optimization design of similar electroplating process and the study of electroplating mechanism. |
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