| ZHANG Lin-qi,XIA Lin,PENG Jin,ZOU Wen-jun.Effects of pH Value and Surfactant on Silicon Sol CMP Slurry[J],43(4):24-26,36 |
| Effects of pH Value and Surfactant on Silicon Sol CMP Slurry |
| Received:February 21, 2014 Revised:April 17, 2014 |
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| DOI： |
| KeyWord:silica sol CMP slurry pH value surfactant |
| Author | Institution |
| ZHANG Lin-qi |
School of Materials Science and Engineering, Henan University of Technology, Zhengzhou ,China |
| XIA Lin |
School of Materials Science and Engineering, Henan University of Technology, Zhengzhou ,China |
| PENG Jin |
School of Materials Science and Engineering, Henan University of Technology, Zhengzhou ,China |
| ZOU Wen-jun |
School of Materials Science and Engineering, Henan University of Technology, Zhengzhou ,China |
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| Abstract: |
| Objective On the basis of preparing silicon sol polishing liquid for CMP process, the effects of pH value and surfactants on the reliability and properties of CMP slurry were studied. Methods Different pH values of CMP polishing liquid were configured through adding acidic or alkaline pH adjusting agent into the polishing liquid. The stabilizing mechanism of surfactants on the polishing solution was studied. Results When the pH of CMP solution was 9. 5, and Non-ionic surfactant was added, after 90 min, the surface roughness of polished aluminum alloy was decreased by 55. 4% , and the brightness was increased by 131% . The polishing quality of aluminum alloy surface was good. Conclusion Research showed the excellent stability and polishing performance of the polishing solution in weakly alkaline condition. Non-ionic surfactants were beneficial to the stability of CMP polishing liquid. |
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