| KOU Yu-jie,ZHANG Pan-pan,NIU Yong-an,LIU Jun-kai,BAI Rui,LI Yao.Study on the Structure of SiC / PI Composite Film and Its Performance in Carbonization Process[J],43(2):42-48 |
| Study on the Structure of SiC / PI Composite Film and Its Performance in Carbonization Process |
| Received:October 26, 2013 Revised:December 04, 2013 |
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| DOI： |
| KeyWord:SiC / PI composite films wear-resistant coating carbonization microcosmic structure |
| Author | Institution |
| KOU Yu-jie |
Centre for Composite Materials and Structures, Harbin Institute of Technology, Harbin , China |
| ZHANG Pan-pan |
Centre for Composite Materials and Structures, Harbin Institute of Technology, Harbin , China |
| NIU Yong-an |
Centre for Composite Materials and Structures, Harbin Institute of Technology, Harbin , China |
| LIU Jun-kai |
Centre for Composite Materials and Structures, Harbin Institute of Technology, Harbin , China |
| BAI Rui |
Centre for Composite Materials and Structures, Harbin Institute of Technology, Harbin , China |
| LI Yao |
Centre for Composite Materials and Structures, Harbin Institute of Technology, Harbin , China |
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| Abstract: |
| Objective To broaden the application area of silicon carbide reinforced polyimide ( SiC / PI) composite film as erosion resistant coating. Methods The stretch film forming method was used to prepare SiC / PI composite films, then SiC / PI film was carbonized at temperatures ranging from 600 to 1000 益 , and the carbon films were analyzed by SEM, XRD and FTIR tests for the change of the organizational structure after carbonization. Results Due to its role as a physical junction, silicon carbide nano-particles increased the heat stability and carbon yield of the films, and granted the films with plastic fracture characteristics. As the temperature increased, the Hexagonal carbon layer structure was gradually formed. Silicon carbide and polyimide aromatic nuclear free radical polymerized and produced molecules with more rings in carbonization, and Si—O bonds were formed on the interface of SiC and PI. Conclusion During the carbonization, the nano-particles SiC and PI interacted to form weak bond, improving the interface bonding and the heat resistance of carbon films. |
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