| PENG Jin,XIA Lin,ZOU Wen-jun.Research status and Prospect of Chemical Mechanical Polishing Slurry[J],(4):95-98 |
| Research status and Prospect of Chemical Mechanical Polishing Slurry |
| Received:March 29, 2012 Revised:August 20, 2012 |
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| DOI： |
| KeyWord:CMP slurry SiO2 Al2O3 CeO2 Nanodiamond |
| Author | Institution |
| PENG Jin |
College of Materials Science and Engineering, Henan University of Technology, Zhengzhou , China |
| XIA Lin |
College of Materials Science and Engineering, Henan University of Technology, Zhengzhou , China |
| ZOU Wen-jun |
College of Materials Science and Engineering, Henan University of Technology, Zhengzhou , China |
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| Abstract: |
| The main composition and function of chemical mechanical polishing(CMP)slurry were elaborated. The developing status of CMP surry in recent years was summarized. It mainly introduced SiO2 sol polishing slurry, Al2O3 polishing slurry, CeO2 polishing slurry, nanodiamond polishing slurry. Finally, the research trends of CMP slurry were pointed out which were environmental protection, refinement, hyperspecialization. |
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