| XING Fang-fang,CHENG Yan-hai,ZHANG Shi-ju,CHEN Heng-yang.The Effect of Succinic Acid and Sodium Tungsten on Plating Rate of Electroless Ni-W-P Alloy Coating[J],(4):7-9 |
| The Effect of Succinic Acid and Sodium Tungsten on Plating Rate of Electroless Ni-W-P Alloy Coating |
| Received:March 07, 2012 Revised:August 20, 2012 |
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| DOI： |
| KeyWord:electroless plating Ni-W-P alloy coating plating rate surface morphology |
| Author | Institution |
| XING Fang-fang |
School of Mechatronic Engineering, China University of Mining and Technology, Xuzhou , China |
| CHENG Yan-hai |
School of Mechatronic Engineering, China University of Mining and Technology, Xuzhou , China |
| ZHANG Shi-ju |
School of Mechatronic Engineering, China University of Mining and Technology, Xuzhou , China |
| CHEN Heng-yang |
School of Mechatronic Engineering, China University of Mining and Technology, Xuzhou , China |
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| Abstract: |
| Using electroless plating method, different ternary Ni-W-P alloy coatings were deposited on low carbon steel substrates by adjusting bath formula. The plating rate and surface morphology of different samples were characterized. The results show that the different content of reagent in the bath will have a great impact on the plating rate and the surface morphology of coating. Succinic acid has obvious accelerating action, plating rate decrease with increasing of content of sodium tungstate. The different content of succinic acid and sodium tungstate can change the surface morphology of the coating. |
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