| TENG Pei-xiu,WEI Zhe-liang,ZHAO Wei.Kinetics of Immersion Silver Plating onto Copper Substrate in Ethanol-based Solution System[J],(2):38-42 |
| Kinetics of Immersion Silver Plating onto Copper Substrate in Ethanol-based Solution System |
| Received:November 28, 2011 Revised:April 20, 2012 |
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| DOI： |
| KeyWord:kinetics red copper immersion silver ethanol deposition rate |
| Author | Institution |
| TENG Pei-xiu |
College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou , China |
| WEI Zhe-liang |
College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou , China |
| ZHAO Wei |
College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou , China |
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| Abstract: |
| Silver planting on the surface of red copper was obtained by using silver nitrate as main salt, ethylene-diamine as complexant and ethanol as solvent. Variation of mean deposition rate for immersion silver along with plating time was investigated. Each reaction order and the apparent activation energy were obtained by linear-fitting of the relation curve between deposition rate and silver ion concentration, amount of ethylenediamine, temperature of the solution, the pH value and amount of ethanol. Kinetics equations of deposition rate were got and be verified. |
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