XU Chao,CHEN Fan-cai,WU Dao-ming,WANG Zi-tian,LI Wen-zhen,LI Lin.A Study on the Electrodeposition Behaviors of Nickel-iron-tungsten Alloy[J],39(5):26-29,71
A Study on the Electrodeposition Behaviors of Nickel-iron-tungsten Alloy
Received:July 19, 2010  Revised:October 10, 2010
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KeyWord:nickel-iron-tungsten  electrodeposition  electrocrystallization mechanism
                 
AuthorInstitution
XU Chao School of Chemistry and Chemical Engineering of Hunan University,Changsha ,China
CHEN Fan-cai School of Chemistry and Chemical Engineering of Hunan University,Changsha ,China
WU Dao-ming School of Chemistry and Chemical Engineering of Hunan University,Changsha ,China
WANG Zi-tian School of Chemistry and Chemical Engineering of Hunan University,Changsha ,China
LI Wen-zhen School of Chemistry and Chemical Engineering of Hunan University,Changsha ,China
LI Lin School of Chemistry and Chemical Engineering of Hunan University,Changsha ,China
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Abstract:
      The electrodeposition mechanism of nickel-iron-tungsten alloy were studied by the methods of electrochemistry, and the micromorphology and composition of nickel-iron-tungsten alloy were characterized.Cyclic voltammogram indicated that the electrodeposition of nickel-iron-tungsten alloy wasirreversible growth process,and the electrocrystal-lization mechanism didn't change with the variety of the concentration of WO42-.Chronoamperometric results indicated that the electrodeposition of nickel-iron-tungsten alloy at copperelectrode belonged to a three-dimensionalinstantaneous nucleationmech-anism. SEM images of electrodeposit showed that the nickel-iron-tungsten alloy was made of lots of crystalline grain which was several tens nanometers, and the atom composition was 58.76%Ni,32.72%Fe,8.52%W.
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