LV Xiao-li,FENG Chang-jie,ZHONG Xiao-rong,WAN Xiao-huan,DU Nan.Study on the Process of Horizontally Vibrating Mechanical Attrition Electroplating Cu Coatings[J],39(3):74-77
Study on the Process of Horizontally Vibrating Mechanical Attrition Electroplating Cu Coatings
Received:January 29, 2010  Revised:June 10, 2010
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KeyWord:horizontally vibrating  mechanical attrition  electrodeposition  Cu coating  microstructure  process
              
AuthorInstitution
LV Xiao-li Nanchang Hangkong University, Nanchang , China
FENG Chang-jie Nanchang Hangkong University, Nanchang , China
ZHONG Xiao-rong Nanchang Hangkong University, Nanchang , China
WAN Xiao-huan Nanchang Hangkong University, Nanchang , China
DU Nan Nanchang Hangkong University, Nanchang , China
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Abstract:
      The mechanical attrition was supplied in a traditional acid electroplating process of Cu. The effects of the number of the glass balls and their vibrating frequency on the microstructure of the mechanical attrition electroplating were analyzed by SEM and XRD. The results show that, compared with the traditional electroplated Cu coating, when the number of glass balls is 80 and vibrating are set to 2.5 to 4.2 Hz, the grain size of the Cu coatings decrease significantly with the increase of vibrating frequency. And when the vibrating frequency is set to 4.2 Hz and the number of the glass balls is 40 to 120, with the increase of the number of glass balls, the grain size of the Cu coatings decrease initially and then slightly increase, but still smaller than that of traditional electroplated Cu coating. Horizontally vibrating mechanical attrition electroplating Cu coatings have(111)preferred orientation, but their extents are influenced by the vibrating conditions.
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