| ZENG Xian-guang,YU Lan-ying,LI Xin-yue,ZHENG Xing-wen.Prepation and Study on New Phosphate Adhesive at High Temperature[J],39(1):103-105 |
| Prepation and Study on New Phosphate Adhesive at High Temperature |
| Received:October 30, 2009 Revised:February 10, 2010 |
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| DOI： |
| KeyWord:Phosphate Adhesives High temperature |
| Author | Institution |
| ZENG Xian-guang |
Sichuan University of Science and Engineering, Zigong , China |
| YU Lan-ying |
Sichuan University of Science and Engineering, Zigong , China |
| LI Xin-yue |
Sichuan University of Science and Engineering, Zigong , China |
| ZHENG Xing-wen |
Sichuan University of Science and Engineering, Zigong , China |
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| Abstract: |
| Some raw materials such as phosphoric acid,aluminum hydroxide and copper oxide were mainly used to prepare adhesive with high bond and heat-resisting, a optimal adhesive formulation was selected through orthogonal experimental method. The effect of copper oxide particle size, curing temperature, curing time and aluminum hydroxide on the bonding properties was discussed. Results show that new phosphate adhesive is provided with simple preparation process, good adhesion, heat-resisting and broad application prospects, and it appeares pale yellow green with curing temperature of 120℃ and curing time of 4 h. |
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