SUN Hua,MA Hong-fang,LIU Ke-gao,LIU Yi.Optimization of Technology of Electroless Ni-P Pretreatment Process on the Aluminum Alloy Surface[J],39(1):67-70
Optimization of Technology of Electroless Ni-P Pretreatment Process on the Aluminum Alloy Surface
Received:July 31, 2009  Revised:February 10, 2010
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KeyWord:Electroless plating  Ni-P alloy  Deposition rate  Coating performance  Activation and pre-electroless process
           
AuthorInstitution
SUN Hua Shandong Jianzhu University, Jinan , China
MA Hong-fang Shandong Jianzhu University, Jinan , China
LIU Ke-gao Shandong Jianzhu University, Jinan , China
LIU Yi Shandong Jianzhu University, Jinan , China
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Abstract:
      The electroless Ni-P coating could improve the defects of aluminum alloy such as intercrystalline corrosion occurred easily, low surface hardness,poor abrasion resistance. To obtain good combination force of the coating and aluminum substrate the pre-treatment process is even more important. Analyzed by orthogonal tests and maximum difference method, the important orders that the processing parameters of activation and pre-nickel plating affect the subsequent electroless plating Ni-P plating rate are determined. The optimal formula and processing conditions of activation and pre-nickel plating were also determined. The morphology and properties of the coatings obtained by activation and pre-nickel plating were investigated by metallographic microscope, scanning electron microscope, weight gain and loss method and thermal shock tests. Experimental results show that: the new activation and pre-electroless technology can significantly improve the microhardness, deposition rate and bonding strength with the substrate of Ni-P coating. The coating obtained as such has dense and homogenous microstructures and good corrosion resistance.
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