ZHANG Yong,AN Zheng-tao,YAN Jun,XIE Jun-lei.The Progress of Study on Low-temperature, High-speed and High Stability Chenucal Plating[J],37(6):81-83
The Progress of Study on Low-temperature, High-speed and High Stability Chenucal Plating
Received:July 21, 2008  Revised:December 10, 2008
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KeyWord:Chemical plating nickel  Amorphous alloy  Low-temperature  High-speed  Plating solution stability  Electromagnetic shield
           
AuthorInstitution
ZHANG Yong Ordnance Engineering College, Shijiazhuang , China
AN Zheng-tao Ordnance Engineering College, Shijiazhuang , China
YAN Jun Ordnance Engineering College, Shijiazhuang , China
XIE Jun-lei Ordnance Engineering College, Shijiazhuang , China
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Abstract:
      Ni-P amorphous alloy cladding possesses the fine electromagnetism and static electricity protective performance as a kind of function cladding material, as well as the fine physical chemistry function. Currently, many study adopts the acidic plating solution, the temperature is upper, so the application of chemical plating is limited, especially chemical plating on the surface of plastic. So, chemical plating under the condition of low temperature and high speed is regarded by investigator; simultaneously, the stability of plating solution is important factor that whether chemical plating can successful or not, and reduce the cost of chemical plating. The research of chemical plating nickel in low temperature and high speed and plating solution stability was summarized, and the development direction of chemical plating nickel was viewed
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