ZHANG Yong,AN Zheng-tao,YAN Jun,XIE Jun-lei.The Progress of Study on Low-temperature, High-speed and High Stability Chenucal Plating[J],37(6):81-83 |
The Progress of Study on Low-temperature, High-speed and High Stability Chenucal Plating |
Received:July 21, 2008 Revised:December 10, 2008 |
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KeyWord:Chemical plating nickel Amorphous alloy Low-temperature High-speed Plating solution stability Electromagnetic shield |
Author | Institution |
ZHANG Yong |
Ordnance Engineering College, Shijiazhuang , China |
AN Zheng-tao |
Ordnance Engineering College, Shijiazhuang , China |
YAN Jun |
Ordnance Engineering College, Shijiazhuang , China |
XIE Jun-lei |
Ordnance Engineering College, Shijiazhuang , China |
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Abstract: |
Ni-P amorphous alloy cladding possesses the fine electromagnetism and static electricity protective performance as a kind of function cladding material, as well as the fine physical chemistry function. Currently, many study adopts the acidic plating solution, the temperature is upper, so the application of chemical plating is limited, especially chemical plating on the surface of plastic. So, chemical plating under the condition of low temperature and high speed is regarded by investigator; simultaneously, the stability of plating solution is important factor that whether chemical plating can successful or not, and reduce the cost of chemical plating. The research of chemical plating nickel in low temperature and high speed and plating solution stability was summarized, and the development direction of chemical plating nickel was viewed |
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