| WANG Guo-fan,MIAO Lei,LUO Hui,ZHANG Wei-yi.Oxidation Resistance of Aluminized Layer on Red Copper at Hight Temperature[J],37(3):19-21 |
| Oxidation Resistance of Aluminized Layer on Red Copper at Hight Temperature |
| Received:March 04, 2008 Revised:June 10, 2008 |
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| DOI： |
| KeyWord:Red copper Aluminized coating High-temperature oxidation Al203 scale Optical analysis |
| Author | Institution |
| WANG Guo-fan |
College of Materials Science and Engineering, Shandong Jianzhu University, Jinan , China |
| MIAO Lei |
College of Materials Science and Engineering, Shandong Jianzhu University, Jinan , China |
| LUO Hui |
College of Materials Science and Engineering, Shandong Jianzhu University, Jinan , China |
| ZHANG Wei-yi |
College of Materials Science and Engineering, Shandong Jianzhu University, Jinan , China |
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| Abstract: |
| Red copper was aluminized by means of pack cementation. The oxidation behavior of red copper and aluminized copper in air at high temperature was investigated. The micromorphology and phase composition of the formed oxide scales were examined by SEM and XRD, and the oxidation mechanism was discussed. The results indicate that the oxidation resistance of Cu is significantly improved by aluminizing treatment. The oxidation behavior and the structure of the oxide scale were changed after red copper was aluminized, too. After oxidation at 7000C for lOOh, the formed oxide scale on red copper consists of Cu20, Cuo and that on aluminized Cu is mainly composed of Al203. The oxidation kinetic curves follow parabolic rate law. |
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