| DONG Kun,LI De-Iiang,WU Gan-hong.Study on Lead-free Stabilizer for Electroless Nickel Plating[J],37(3):12-13,29 |
| Study on Lead-free Stabilizer for Electroless Nickel Plating |
| Received:March 07, 2008 Revised:June 10, 2008 |
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| DOI： |
| KeyWord:Electroless nickel plating Lead-free Stabilizer Depositing velocity |
| Author | Institution |
| DONG Kun |
School of Resource and Environment, CSFTU, Changsha , China |
| LI De-Iiang |
School of Resource and Environment, CSFTU, Changsha , China |
| WU Gan-hong |
School of Resource and Environment, CSFTU, Changsha , China |
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| Abstract: |
| In order to study the lead-free stabilizer for electroless nickel plating, four stabilizers of Na2S203 , S1 , CuS04 and benzotriazole were added respectively, and the stabilizing effects of these four stabilizers on electroless nickel bath were investigated. It is found that Sl is an excellent electroless nickel bath stabilizer which can not only stabilize the bath very well but also bring an excellent corrosion resistance. |
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