PENG Shu,TANG Zhen-fang,JI Rui.Study on the Anti-oxidation Capability of Micro Copper Powder in Organic Medium[J],37(3):6-8
Study on the Anti-oxidation Capability of Micro Copper Powder in Organic Medium
Received:March 07, 2008  Revised:June 10, 2008
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KeyWord:Isotropic conductive adhesive  Silver plated copper powder  Organic film  Oxidation resistance
        
AuthorInstitution
PENG Shu Department of Physics, Jinan University, Guangzhou , China
TANG Zhen-fang Department of Physics, Jinan University, Guangzhou , China
JI Rui Department of Physics, Jinan University, Guangzhou , China
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Abstract:
      A special organic film was coated on the surface of the micro copper powder and the silver-plated copper powder in isotropic conductive adhesive to anti-oxidize them and the anti-oxidize capacities of products were tested though scanning electronic microscope analysis, X-ray diffraction analysis, thermal gravimetric analysis, accelerated aging test and electric conductivity test. The results show that the micro conductive copper powdr treated silve plating and covered with organic fiml has optimal anti-oxidation capacity.
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