LIU Jiong,HU Dong-ping,XUE Qi,TANG An-jun,WU Ke.Interlayer Technology Between CVD Diamond Films and WC-Co Substrates[J],36(5):88-90
Interlayer Technology Between CVD Diamond Films and WC-Co Substrates
Received:July 10, 2007  Revised:October 10, 2007
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KeyWord:Diamond coatings  Adhesion strength  Interlayer  Hard alloy
              
AuthorInstitution
LIU Jiong Petroleum Industry Institute for Quality Surveillance and Inspection of Well-Control Equipment, Sichuan Petroleum Administration, Guanghan , China
HU Dong-ping China Academy of Engineering Physics, Mianyang , China
XUE Qi Department of Materials Science and Engineering, Southwest Petroleum University, Chengdu , China
TANG An-jun Department of Materials Science and Engineering, Southwest Petroleum University, Chengdu , China
WU Ke Chuanyou Honghua Co. , Ltd, GuangHan , China
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Abstract:
      Interlayer technology, which is helpful in improving the adhesion strength between diamond films and WC-Co substrate, was briefly introduced mainly including the functions of interlayer, the factors that should be considered when interlayer design, and the factors responsible for the properties of interlayer. Some typical examples were also given.
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