LIU Jiong,HU Dong-ping,XUE Qi,TANG An-jun,WU Ke.Interlayer Technology Between CVD Diamond Films and WC-Co Substrates[J],36(5):88-90 |
Interlayer Technology Between CVD Diamond Films and WC-Co Substrates |
Received:July 10, 2007 Revised:October 10, 2007 |
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DOI: |
KeyWord:Diamond coatings Adhesion strength Interlayer Hard alloy |
Author | Institution |
LIU Jiong |
Petroleum Industry Institute for Quality Surveillance and Inspection of Well-Control Equipment, Sichuan Petroleum Administration, Guanghan , China |
HU Dong-ping |
China Academy of Engineering Physics, Mianyang , China |
XUE Qi |
Department of Materials Science and Engineering, Southwest Petroleum University, Chengdu , China |
TANG An-jun |
Department of Materials Science and Engineering, Southwest Petroleum University, Chengdu , China |
WU Ke |
Chuanyou Honghua Co. , Ltd, GuangHan , China |
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Abstract: |
Interlayer technology, which is helpful in improving the adhesion strength between diamond films and WC-Co substrate, was briefly introduced mainly including the functions of interlayer, the factors that should be considered when interlayer design, and the factors responsible for the properties of interlayer. Some typical examples were also given. |
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