| LI Yun-dong,LU Hui-yang,SU Zong-wei,DING Jun-cheng.Discussions about Effects of Diamond Incorporation on the Microstructure of Electroplated Ni-Co-diamond Composites[J],36(5):8-11 |
| Discussions about Effects of Diamond Incorporation on the Microstructure of Electroplated Ni-Co-diamond Composites |
| Received:July 03, 2007 Revised:October 10, 2007 |
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| DOI： |
| KeyWord:Electrodeposition Composite deposite Ni-Co-diamond Microstructure Metallic inclusion magnetization |
| Author | Institution |
| LI Yun-dong |
College of Mechanical and Electrical Engineering, Henan Agricultural University, Zhengzhou , China |
| LU Hui-yang |
College of Mechanical and Electrical Engineering, Henan Agricultural University, Zhengzhou , China |
| SU Zong-wei |
College of Mechanical and Electrical Engineering, Henan Agricultural University, Zhengzhou , China |
| DING Jun-cheng |
College of Mechanical and Electrical Engineering, Henan Agricultural University, Zhengzhou , China |
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| Abstract: |
| Electrodeposited diamond composite coatings have been widely studied for improving the hardness, wear resistance and self-lubrication. The detrimental impacts of diamond incorporation on the composites microstructure was reported. It is shown that the incorporation significantly worsens the microstructure , like coarsening the matrix grain , inducing gaps between matrix and diamonds, and promoting emergence of domed nodules, valleys and over-plating cases on the fluctuant matrix surface. All the deterioration facts are believed to arise from metallic inclusions trapped in diamond crystals during their synthetic process. |
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