| LIU Si-yong,LIN Li,YANG Wu-bao,SUN Hui-feng.Technology Optimization of Reactive Ion Plating for AIN Film and Its Analysis[J],36(3):37-39 |
| Technology Optimization of Reactive Ion Plating for AIN Film and Its Analysis |
| Received:March 05, 2007 Revised:June 10, 2007 |
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| DOI： |
| KeyWord:AIN Film Reactive ion plating Technology optimization |
| Author | Institution |
| LIU Si-yong |
Material Department of Electromechanical and Engineering College ,China University of Petroleum Beijing , Beijing , China |
| LIN Li |
Material Department of Electromechanical and Engineering College ,China University of Petroleum Beijing , Beijing , China |
| YANG Wu-bao |
Material Department of Electromechanical and Engineering College ,China University of Petroleum Beijing , Beijing , China |
| SUN Hui-feng |
Material Department of Electromechanical and Engineering College ,China University of Petroleum Beijing , Beijing , China |
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| Abstract: |
| AIN film was produced on glass with high-pure N2 and Al by reactive ion plating. The result of orthogonal design indicates that the largest deposited speed is about 0. 8lym/min , its technology parameters are like this : the evaporating voltage is 225V, the bombarding voltage is 70V, the vacuum degree is l. 2 x 10-2torr. The film was analyzed by XRD, AFM, near infrared spectrum, and Raman spectrum, which ensured the AIN films presence. |
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