WANG Wei-jiang,Werner Jillek,Armin Lenhar,YU Zu-zhan.Investigation on Electronic Circuit Preparation Using Selective Laser Sintering of Copper and Tungsten[J],36(3):20-22,48
Investigation on Electronic Circuit Preparation Using Selective Laser Sintering of Copper and Tungsten
Received:March 11, 2007  Revised:June 10, 2007
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KeyWord:Laser sintering  Metal deposition  Electroless plating  Electronic circuit  Picture preparation
           
AuthorInstitution
WANG Wei-jiang Chemistry Department, Fudan University, Shanghai , China
Werner Jillek Electronic Engineering Department, University of Applied Science, Neurnberg, Germany
Armin Lenhar Electronic Engineering Department, University of Applied Science, Neurnberg, Germany
YU Zu-zhan Chemistry Department, Fudan University, Shanghai , China
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Abstract:
      To improve the production technique for conductive circuits, we use new kind of laser sintering technique to sinter metallic and nonmetallic lines, circuits or pictures ( for example, profiles of people and animals) on a substrate , such as Al2 03 ceramics, glass, semiconductor or plastics, which might be used for repair of damaged circuits, making of labels or marks, production of electronic circuits, and etc. Here, we will report some research results about the processes and characteristic of tungsten and copper patterns laser sintered on Al203 ceramics substrates. It is also introduced that the methods of precursor preparation for the laser sintering.
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