| YUAN Ying,SONG PeiWei,ZHAO Kang.Plating Structure and Thermal stability of Micro Silver-coated Copper Powder[J],36(1):11-13 |
| Plating Structure and Thermal stability of Micro Silver-coated Copper Powder |
| Received:November 11, 2006 Revised:February 10, 2007 |
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| DOI： |
| KeyWord:Copper power Silver-coated copper powder Thermal stability Plating structure |
| Author | Institution |
| YUAN Ying |
School of High Technology, Xi´an University of Technology, Xi´an , China |
| SONG PeiWei |
School of mechanical engineering, Shaanxi University of technology,Hanzhong， China |
| ZHAO Kang |
School of Materials Science and Engineering, Xi´an University of Technology, Xi´an , China |
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| Abstract: |
| The micro silver-coated copper powder with high temperature of oxidation resistance was prepared by chemistry substitutional and chemistry plating reaction. The surface topography, microstructure and oxidation resistance of the coated powder were characterized by SEM, XRD, TG and other methods. It was found that the Coating structure of copper power related to mechanism of nucleus forming and content of silver, Thermal stability is affected by plating structure of silver-coated copper power. Silver-coated copper powder with coated structure have higher thermal stability, it is not oxidize even at 800℃. |
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