DONG Yinggang,REN Jianhua,ZHOU Chao,YIN Guanhua,YAO Chuanhui.Effect of Pulse Parameters on Properties of Pulse Electroforming Nickel by Microbead Adaptive Assisted Grinding[J],54(10):246-255
Effect of Pulse Parameters on Properties of Pulse Electroforming Nickel by Microbead Adaptive Assisted Grinding
Received:August 05, 2024  Revised:January 11, 2025
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DOI:10.16490/j.cnki.issn.1001-3660.2025.10.020
KeyWord:microbead adaptive assisted grinding  duty cycle  pulse frequency  pulse electroforming  nickel  flexible support  surface quality
              
AuthorInstitution
DONG Yinggang School of Mechanical Engineering, Shandong University of Technology, Shandong Zibo , China
REN Jianhua School of Mechanical Engineering, Shandong University of Technology, Shandong Zibo , China
ZHOU Chao School of Mechanical Engineering, Shandong University of Technology, Shandong Zibo , China
YIN Guanhua School of Mechanical Engineering, Shandong University of Technology, Shandong Zibo , China
YAO Chuanhui School of Mechanical Engineering, Shandong University of Technology, Shandong Zibo , China
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Abstract:
      In order to improve the performance of electroforming nickel, a microbead adaptive grinding pulse electroforming process was proposed. An appropriate amount of microbeads were filled between the flexible medium and the cathode core mold, and the surface of the cathode was continuously rubbed with microbeads. Combined with the pulse power supply, more growth activation points were generated on the surface of the electroforming layer, which enhanced the fine crystal effect and further refined the grains. At the same time, the effect of removing defects was improved, and the defects such as pinhole and pitting corrosion on the surface of the electroforming layer were eliminated. The performance of the electroforming layer was improved. In the experiment, the experimental parameters of traditional electroforming were DC power current density 3 A/dm² and cathode speed 15 r/min. The parameters of the microbead adaptive auxiliary grinding pulse electroforming were the average current density of the pulse power supply 3 A/dm², duty cycle 50%, pulse frequency 800 Hz and cathode speed 15 r/min. In other tests, the cathode rotation speed was 15 r/min, the average current density was 3A/dm2, and the pulse frequency in the duty cycle experiment was 800 Hz, and the duty cycle was 20%, 40%, 60% and 80%, respectively. In the experiment, the duty cycle was 20%, and the pulse frequencies were 100, 500, 1 000 and 2 000 Hz, respectively. The difference between the properties of the electroforming nickel layer and the traditional electroforming process was studied, and the effect of pulse parameters on the micro-bead adaptive assisted grinding pulse electroforming nickel layer was studied. The effects of different pulse frequencies on the surface microstructure, microhardness and surface roughness of the electroforming layer were studied. The surface micromorphology (SEM), surface roughness (Ra), microhardness, metallographic structure and XRD of the electroforming layer with different duty cycle ratio were studied. Compared with the traditional electroforming process, the performance of the electroforming layer obtained by the micro-bead adaptive grinding pulse electroforming process was significantly improved. With the increase of pulse frequency, the performance of the electroforming layer was significantly improved, but when the pulse frequency was increased to 1 000 Hz, the performance improvement of the electroforming layer decreased. In contrast, the duty cycle ratio had a greater impact on the properties of the deposited layer:compared with the nickel layer deposited at 80% duty cycle, the surface roughness (Ra) of the nickel layer deposited at 20% duty cycle was reduced by approximately 52.5%, the microhardness value was increased by 14.12%, and the average grain size was reduced by 53.6%. XRD results showed that the diffraction intensity on the surface of (111) layer was the strongest, and the diffraction intensity on the surface of (200) layer was the weakest, and the difference between them was the smallest. For optimum grain orientation, when other conditions remain unchanged, the grain size of the electroforming layer coarsened gradually, and the microhardness, surface roughness and grain preference orientation decreased gradually with the gradual increase of duty cycle. The results show that the performance of the electroforming nickel layer can be improved by adopting the micro-bead adaptive grinding pulse electroforming process. Larger pulse frequency can improve the effect of grain refinement and defect removal, but further increase of pulse frequency has little effect on the properties of the deposited nickel layer. The effect of pulse power supply with lower duty cycle can improve grain refinement and defect removal.
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