| ZHONG Li,CHEN Meiyan,LIU Xuan,ZHANG Yue,YAO Ke.Effect of Sputtering Technique on the Structure and Electrical Properties of Copper Films on the Surface of BT Plates[J],54(8):227-234 |
| Effect of Sputtering Technique on the Structure and Electrical Properties of Copper Films on the Surface of BT Plates |
| Received:July 11, 2024 Revised:February 20, 2025 |
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| DOI：10.16490/j.cnki.issn.1001-3660.2025.08.021 |
| KeyWord:high power pulsed magnetron coating DC magnetron sputtering coating BT plate surface metallization XPS |
| Author | Institution |
| ZHONG Li |
Southwest Institute of Physics, Chengdu , China |
| CHEN Meiyan |
Southwest Institute of Physics, Chengdu , China |
| LIU Xuan |
Southwest Institute of Physics, Chengdu , China |
| ZHANG Yue |
Southwest Institute of Physics, Chengdu , China |
| YAO Ke |
Southwest Institute of Physics, Chengdu , China |
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| Abstract: |
| High-power pulsed magnetron sputtering coating technology (short in HiPIMS) is an advanced surface modification technology which uses pulsed transient high energy current density of the ion beam to form coatings on the surface of the substrate and controls the rate of temperature rise of the substrate and the microscopic properties of coatings by reducing the average power. Therefore, it has received widespread attention and vigorous development in recent years, but its in-depth comparison with the DC magnetron sputtering technology (short in DCMS) is not sufficient yet. Due to the large differences in physical and chemical properties and poor compatibility between the BT resin material and the copper coating, the interface bonding strength is low between the substrate and the coating, which becomes the source of defects such as microcracks in the coating. The work aims to study the microscopic and macroscopic properties of copper films deposited on BT resin materials by DCMS and HiPIMS respectively. The BT resin was cut into long rectangles of 20 mm×20 mm×1 mm as the base material and ultrasonically cleaned by acetone and anhydrous ethanol and dried. The base material was cleaned and activated through glow sputtering by a low-energy, wide-amplitude and large-current ion beam generated by the filamentless bar-Hall ion source under the vacuum condition of 3×10−3 Pa, and then the copper film was deposited by DCMS and HiPIMS respectively. The current of DCMS was 2 A, the peak current and the average power of HiPIMS were 60 A and 400 W correspondingly, and the thicknesses of both copper films were 1 μm. Then, the microstructure of the films was observed by a scanning electron microscope (FEI-NOVA NANO 230 type) and the component was analyzed by the EDS spectrum of each selected point taken by an energy spectrometer (X-MAX5 type). The density of the surface copper film was analyzed by MIP method and the phase composition was investigated by an X-ray diffractometer (EMPYREAN). The bonding strength between the film layer and the base was qualitatively judged by the scratch test and quantitatively characterized by the pull-off test referring to the standard GB/T9286-2021. The square resistance of the thin layer was tested by a dual electric measurement instrument with four probes (RTS-5). Two well-formed metallic copper coatings are successfully deposited on the surface of BT resin material by both DCMS and HiPIMS. The coating deposited by DCMS has higher crystallinity while the coating deposited by HiPIMS has lower porosity, finer grains and higher relative purity. Although the HiPIMS coating has better microscopic properties, the advantage does not have an obvious effect in conductivity because of that the electrical properties is much more affected by a variety of factors in crystallization aspect, such as grain orientation, grain boundary length, etc. The square resistance of the coatings is tested to be 23 mΩ/□ for DCMS and 337 mΩ/□ for HiPIMS. DCMS and HiPIMS both can be applied and developed on the surface metallization of the BT plate, and the copper coating deposited by HiPIMS shows weaker electrical properties than the copper coating deposited by DCMS although it has better microscopic properties, so HiPIMS could not completely replace DCMS at present in the practical application of the project without a sustained in-depth research of the coating such as phase regulation, purity and electrical properties, etc. |
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