| PENG Xuesong,GUI Haoliang,JIANG Jie,LI Yaqiang,WANG Zongtai,LI Ruopeng,AN Maozhong.Effect of Sodium Tungstate and Its Composite Additives on the Roughening Effect of Ultra-thin Copper Foil[J],54(8):191-200 |
| Effect of Sodium Tungstate and Its Composite Additives on the Roughening Effect of Ultra-thin Copper Foil |
| Received:June 20, 2024 Revised:December 11, 2024 |
| View Full Text View/Add Comment Download reader |
| DOI：10.16490/j.cnki.issn.1001-3660.2025.08.017 |
| KeyWord:electrolytic copper foil additive surface roughening peel strength roughness |
| Author | Institution |
| PENG Xuesong |
School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin , China |
| GUI Haoliang |
School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin , China |
| JIANG Jie |
School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin , China |
| LI Yaqiang |
College of Chemistry, Fuzhou University, Fuzhou , China |
| WANG Zongtai |
China Nuclear Power Engineering Co., Ltd., Beijing , China |
| LI Ruopeng |
School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin , China |
| AN Maozhong |
School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin , China |
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| Abstract: |
| The work aims to systematically improve the roughening performance of electrolytic copper foil with a composite additive of sodium molybdate, sodium tungstate, and hydroxyethyl cellulose (HEC). Electrolytic copper foil is widely used in electronic devices, especially printed circuit boards (PCBs), with key performance requirements including high peel strength and low surface roughness. In order to optimize these properties, direct current electroplating was used in a copper sulfate electroplating system and various characterization techniques were employed such as scanning electron microscopy (SEM), laser confocal microscopy (LCM), and peel strength testing. The microstructure of the rough copper foil was analyzed in detail, and the impact of various additives on the roughening effect was analyzed through orthogonal experiments and range analysis. The addition of sodium molybdate and HEC alone significantly refined the grain structure of the copper foil surface, improving its smoothness and uniformity. In contrast, sodium tungstate mainly improved the peel strength and had a relatively small impact on grain refinement. The composite additive showed significant synergistic effects, effectively optimizing the microstructure of copper foil under different concentration combinations. Specifically, the concentrations of 40 mg/Lsodium molybdate, 30 mg/L sodium tungstate, and 8 mg/L HEC produced the best roughening results, with the lowest surface roughness (Rz=1.24 µm) and relatively high peel strength (0.94 N/mm). LCM measurements indicated that optimized composite additives significantly reduced surface roughness, helping to minimize signal transmission losses and improve the overall performance and reliability of PCBs. In addition, the importance of the three additives on Q was in the following order:sodium molybdate>sodium tungstate>HEC, and the Q value reached its maximum value (0.76) under optimal conditions. Through a comprehensive analysis of the additive mechanism, the optimal composite additive formulation was identified, significantly improving the roughening performance of copper foil. This method not only enhanced peel strength and surface roughness but also promoted grain refinement, making the copper foil perform exceptionally in high-performance electronic applications. The synergistic effect of the composite additive optimized the microstructure of the copper foil, further improving its overall mechanical properties and adhesion characteristics. The study results demonstrated that the composite additive achieved good effects under different concentration conditions, providing technical support for producing low-profile copper foil suitable for high-performance electronic devices. By systematically optimizing the concentrations of sodium molybdate, sodium tungstate, and HEC composite additives, this study significantly improves the surface and mechanical properties of ultra-thin electrolytic copper foil, proposing innovative research findings. This research provides new directions for the preparation of low-profile electrolytic copper foil, with significant theoretical and practical value. By reducing surface roughness while maintaining high peel strength, this study lays a solid technical foundation for the miniaturization, high performance, and long-term reliability of future electronic devices, further advancing copper foil technology in the electronics industry. |
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