| LIN Jieqiong,XIE Lue,YU Hang,GU Yan,ZHOU Xiaoqin.Analysis of Chip Formation and Evolution Process of SiCp/Al by Pulsed Laser and Ultrasonic Composite Assisted Machining[J],54(8):167-179 |
| Analysis of Chip Formation and Evolution Process of SiCp/Al by Pulsed Laser and Ultrasonic Composite Assisted Machining |
| Received:August 09, 2024 Revised:November 15, 2024 |
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| DOI：10.16490/j.cnki.issn.1001-3660.2025.08.015 |
| KeyWord:pulse laser and ultrasonic composite assisted machining SiCp/Al chip formation mechanism surface quality |
| Author | Institution |
| LIN Jieqiong |
School of Mechanical and Electrical Engineering, Changchun University of Technology, Changchun , China |
| XIE Lue |
School of Mechanical and Electrical Engineering, Changchun University of Technology, Changchun , China |
| YU Hang |
School of Mechanical and Electrical Engineering, Changchun University of Technology, Changchun , China |
| GU Yan |
School of Mechanical and Electrical Engineering, Changchun University of Technology, Changchun , China |
| ZHOU Xiaoqin |
College of Mechanical and Aerospace Engineering, Jilin University, Changchun , China |
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| Abstract: |
| SiCp/Al composites stand out from traditional metal materials due to their exceptional physical properties, including ultra-high hardness, high bending strength and a significantly low thermal expansion coefficient. These attributes render them suitable for a broad range of industrial applications that demand performance under extreme conditions. However, the integration of high-strength SiC particles into the SiCp/Al matrix poses significant challenges in processing. Investigating the chip formation during the machining process is instrumental in uncovering the deformation behavior of the material, which can, in turn, enhance tool life and surface quality through the development of effective processing technologies. |
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