| LI Songhua,TIAN Kai,ZHAO Zichen,ZUO Chuang,WANG Hongliang,GUO Hao.Experimental Study on Narrow and Deep Groove Machining of Silicon Nitride Ceramic Ring[J],54(8):156-166 |
| Experimental Study on Narrow and Deep Groove Machining of Silicon Nitride Ceramic Ring |
| Received:August 07, 2024 Revised:December 17, 2024 |
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| DOI：10.16490/j.cnki.issn.1001-3660.2025.08.014 |
| KeyWord:thin section grinding wheel silicon nitride ceramics narrow deep groove edge damage surface roughness |
| Author | Institution |
| LI Songhua |
School of Mechanical Engineering, Shenyang Jianzhu University, Shenyang , China;National-Local Joint Engineering Laboratory of NC Machining Equipment and Technology of High-Grade Stone, Shenyang , China |
| TIAN Kai |
School of Mechanical Engineering, Shenyang Jianzhu University, Shenyang , China |
| ZHAO Zichen |
School of Mechanical Engineering, Shenyang Jianzhu University, Shenyang , China |
| ZUO Chuang |
School of Mechanical Engineering, Shenyang Jianzhu University, Shenyang , China |
| WANG Hongliang |
School of Mechanical Engineering, Shenyang Jianzhu University, Shenyang , China |
| GUO Hao |
School of Mechanical Engineering, Shenyang Jianzhu University, Shenyang , China |
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| Abstract: |
| The grinding undercut of silicon nitride (Si3N4) ceramic cylindrical roller bearing rings is a narrow and deep groove, and its grinding is a key process for precision grinding of bearing rings. The damage of groove edges and the surface quality of groove side walls have an important influence on the dimensional accuracy and service performance of cylindrical roller bearings. In order to determine the optimal processing parameter range of low edge breakage and high side wall surface quality when grinding silicon nitride ceramic narrow and deep grooves with a thin slice grinding wheel. An innovative evaluation method for the grinding quality of narrow and deep grooves is proposed. The surface roughness Ra of the side wall of the narrow and deep groove and the average edge width Wd of the narrow and deep groove edge are taken as the main evaluation indexes of the machining quality of the narrow and deep groove. Firstly, through the orthogonal test of three factors and four levels, in the range of grinding parameters at grinding wheel linear speed of 34~58 m/s, grinding wheel feed speed of 4~ 16 μm/min and workpiece linear speed of 0.3~0.9 m/s, the primary and secondary order of the influence of the three factors of grinding wheel linear speed, grinding wheel feed speed and workpiece linear speed on the Wd value and Ra value of the silicon nitride ceramic narrow deep groove is determined. Then, the grinding parameter range of the single factor test is determined:the linear speed of the grinding wheel is 35-60 m/s, the feed speed of the grinding wheel is 3-18 um/min, and the linear speed of the workpiece is 0.15-0.9 m/s. Through 18 groups of single factor experiments, the influence mechanism and influence law of grinding parameters on the edge crushing of the narrow deep groove and the surface quality of the groove side wall are explored, and the grinding process parameters of low edge damage and high surface quality of the silicon nitride ceramic narrow deep groove are optimized. The experimental results show that the influence of grinding parameters on the average chipping width Wd value and the surface roughness of the side wall of the narrow and deep groove is in the order of grinding wheel linear speed, grinding wheel feed speed and workpiece linear speed. Wd value and Ra decrease first and then increase with the increase of the grinding wheel speed. When the grinding wheel speed is 50 m/s, both Wd and Ra reach the minimum value. As the feed speed of the grinding wheel increases, both of them increase gradually. The increase of workpiece linear speed leads to the increase of Wd value, and Ra shows a trend of decreasing first and then increasing. It is found that in order to realize the high quality and low damage grinding of the silicon nitride ceramic narrow deep groove, the grinding wheel feed speed and the workpiece linear speed can be appropriately reduced, and the linear speed of the grinding wheel can be improved to ensure the machining quality of the narrow deep groove. It is recommended that the grinding wheel linear speed is 50 m/s, the grinding wheel feed speed is 3 μm/min, and the workpiece linear speed is 0.15-0.45 m/s. The Wd value can be controlled within 15 μm, and the surface roughness can be controlled within 0.050 μm, which meets the requirements of high sidewall surface quality and low edge damage grinding of silicon nitride ceramic narrow deep grooves. |
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