LIN Jieqiong,YU Hang,ZHOU Yan,GU Yan,ZHOU Xiaoqin.Chip Formation Mechanism and Surface Roughness of SiCp/Al Composites by Ultrasonic Vibration-assisted Turning[J],53(6):144-156
Chip Formation Mechanism and Surface Roughness of SiCp/Al Composites by Ultrasonic Vibration-assisted Turning
Received:April 06, 2023  Revised:July 03, 2023
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DOI:10.16490/j.cnki.issn.1001-3660.2024.06.013
KeyWord:ultrasonic vibration assisted turning  SiCp/Al  chip formation mechanism  particle damage  surface integrity  roughness
              
AuthorInstitution
LIN Jieqiong College of Electrical Mechanical Engineering, Changchun University of Technology, Changchun , China
YU Hang College of Electrical Mechanical Engineering, Changchun University of Technology, Changchun , China
ZHOU Yan College of Electrical Mechanical Engineering, Changchun University of Technology, Changchun , China
GU Yan College of Electrical Mechanical Engineering, Changchun University of Technology, Changchun , China
ZHOU Xiaoqin School of Mechanical and Aerospace Engineering, Jilin University, Changchun , China
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Abstract:
      SiCp/Al is a metal matrix composite. It has excellent properties such as wear resistance, high temperature resistance, and fatigue resistance, and is widely used in fields such as aerospace, automobiles, electronics. The excellent physical and chemical properties of SiCp/Al composite materials have attracted widespread attention from the industry. With the application of SiCp/Al composite materials in these fields, there is an urgent demand for their precision machining technology, as well as research on machining methods and cutting mechanisms to improve surface quality.
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