LIN Jieqiong,YU Hang,ZHOU Yan,GU Yan,ZHOU Xiaoqin.Chip Formation Mechanism and Surface Roughness of SiCp/Al Composites by Ultrasonic Vibration-assisted Turning[J],53(6):144-156 |
Chip Formation Mechanism and Surface Roughness of SiCp/Al Composites by Ultrasonic Vibration-assisted Turning |
Received:April 06, 2023 Revised:July 03, 2023 |
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DOI:10.16490/j.cnki.issn.1001-3660.2024.06.013 |
KeyWord:ultrasonic vibration assisted turning SiCp/Al chip formation mechanism particle damage surface integrity roughness |
Author | Institution |
LIN Jieqiong |
College of Electrical Mechanical Engineering, Changchun University of Technology, Changchun , China |
YU Hang |
College of Electrical Mechanical Engineering, Changchun University of Technology, Changchun , China |
ZHOU Yan |
College of Electrical Mechanical Engineering, Changchun University of Technology, Changchun , China |
GU Yan |
College of Electrical Mechanical Engineering, Changchun University of Technology, Changchun , China |
ZHOU Xiaoqin |
School of Mechanical and Aerospace Engineering, Jilin University, Changchun , China |
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Abstract: |
SiCp/Al is a metal matrix composite. It has excellent properties such as wear resistance, high temperature resistance, and fatigue resistance, and is widely used in fields such as aerospace, automobiles, electronics. The excellent physical and chemical properties of SiCp/Al composite materials have attracted widespread attention from the industry. With the application of SiCp/Al composite materials in these fields, there is an urgent demand for their precision machining technology, as well as research on machining methods and cutting mechanisms to improve surface quality. |
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