| LU Wentao,LIU Jinbo,ZHANG Yuan,BAO Yan,DONG Zhigang,KANG Renke.Simulation and Experimental Study on Ultrasonic Assisted Scratching of Tungsten Alloy[J],53(6):133-143 |
| Simulation and Experimental Study on Ultrasonic Assisted Scratching of Tungsten Alloy |
| Received:March 17, 2023 Revised:July 29, 2023 |
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| DOI：10.16490/j.cnki.issn.1001-3660.2024.06.012 |
| KeyWord:tungsten alloy single diamond ultrasonic assisted scratching material removal mechanism finite element simulation |
| Author | Institution |
| LU Wentao |
Dalian University of Technology, Liaoning Dalian , China |
| LIU Jinbo |
Dalian University of Technology, Liaoning Dalian , China |
| ZHANG Yuan |
Dalian University of Technology, Liaoning Dalian , China |
| BAO Yan |
Dalian University of Technology, Liaoning Dalian , China |
| DONG Zhigang |
Dalian University of Technology, Liaoning Dalian , China |
| KANG Renke |
Dalian University of Technology, Liaoning Dalian , China |
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| Abstract: |
| Ultrasonic assisted grinding technology has been utilized to overcome the challenges of severe tool wear and chip adhesion in conventional tungsten alloy grinding. However, the mechanism of material removal under ultrasonic vibration remains unclear. In this research, ultrasonic assisted scratching (UAS) experiment was conducted to investigate the effect of ultrasonic vibration on material surface morphology, cross-sectional profile, and scratching force. A coupled Eulerian-Lagrange (CEL) finite-element (FE) simulation model was established to analyze the changes in scratching force, material temperature, plastic strain, and strain rate during the vibration process. Both simulation and experimental methods revealed the mechanism of material removal and surface creation under ultrasonic vibration action. Firstly, the surface morphology of the scratches was observed by Scanning Electron Microscope (SEM). The result showed that tungsten alloy suffered severe plastic deformation during the scratching process, forming an uplift phenomenon on both sides of the scratches by plowing action. The indenter tended to adhere to the chips during the conventional scratching (CS) process, which resulted in the formation of burrs and plowing groove in the scratching process. In contrast, the UAS surface showed fewer burrs and clear bottom edge, which proved that ultrasonic vibration action could reduce the chip adhesion phenomenon on the indenter. Therefore, the ultrasonic vibration action could effectively suppress the generation of burrs on the scratching surface and the formation of plowing groove at the bottom of the scratches. Posteriorly, the three-dimensional topography of the scratches and their cross-sectional profiles were analyzed by Laser Scan Confocal Microscopy (LSCM), and the result showed that the width of the scratches formed by UAS increased by 39% and the depth increased by 14.1% compared with CS, indicating that larger volume of material was removed by UAS. Subsequently, the changing trend of scratching force with scratching depth of the simulation model was consistent with the experimental results, and the error between the simulation value and the experimental value was 18.1%, which verified the availability of the FE simulation model. Compared with the CS, the scratching force of ultrasonic experiment was reduced by 43.2%. The simulated scratching force showed that the short contact and long separation between the indenter and the workpiece in the UAS process made the scratching force change periodically, which could reduce the average force of the scratching process. Finally, by extracting and analyzing the simulated physical field data of UAS at different time, it was found that the temperature of UAS was reduced by 50% and the surface plastic strain was reduced by 20% compared with the CS process, and the plastic strain rate of the material during ultrasonic impact was increased by one order of magnitude compared with the CS, while the separation process was reduced by two orders of magnitude at most. The aforementioned results indicate that ultrasonic vibration can effectively reduce the scratching force and temperature of the scratching area while also increasing the transient strain rate of the material during the impact process. This prevents chip adhesion to the indenter and inhibits the generation of burrs and plowing groove on the scratching surface, improving surface quality. Additionally, the ultrasonic vibration effect can effectively enhance the material removal rate. |
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