CHENG Jian,JIANG Sheng,ZHANG Zhi-wei,XIE Feng,CHEN Yu-long,HU Wen-xiang.Research Progress on Copper Microelectrodes Materials for Laser Direct Writing[J],52(8):116-128, 150 |
Research Progress on Copper Microelectrodes Materials for Laser Direct Writing |
Received:May 10, 2022 Revised:August 10, 2022 |
View Full Text View/Add Comment Download reader |
DOI:10.16490/j.cnki.issn.1001-3660.2023.08.007 |
KeyWord:laser direct writing copper microelectrode ink substrate material electrical conductivity |
Author | Institution |
CHENG Jian |
School of Mechanical Engineering, Hubei University of Technology, Wuhan , China |
JIANG Sheng |
School of Mechanical Engineering, Hubei University of Technology, Wuhan , China |
ZHANG Zhi-wei |
School of Mechanical Engineering, Hubei University of Technology, Wuhan , China |
XIE Feng |
School of Mechanical Engineering, Hubei University of Technology, Wuhan , China |
CHEN Yu-long |
School of Mechanical Engineering, Hubei University of Technology, Wuhan , China |
HU Wen-xiang |
Precitec Precision Technology Shanghai Co., Ltd., Shanghai , China |
|
Hits: |
Download times: |
Abstract: |
With the rapid development of information technology and the rise of the consumer electronic markets, portable flexible electronic devices such as sensors, planar antennas and displays have attracted widespread attentions. Several metals with excellent conductivity and electrochemical activity, including Au, Ag and Cu, have a wide range of applications in the fabrication of these devices. As a kind of metal with high thermal conductivity, outstanding electrical conductivity and relatively low price, copper is an ideal material for making electrodes of electronic components. However, copper electrodes are prone to be oxidized. Compared with other methods of preparing copper microelectrodes, laser direct writing technology has the characteristics of superior efficiency, high precision, and fast sintering speed, thus significantly decreasing the oxygen content of the reduced copper electrodes in the manufacturing process and simplifying the process steps. At present, laser direct writing of copper microelectrodes refers to using laser to irradiate ink, resulting in the thermal decomposition of the reducing agents dissolved in the ink which are sintered together to form a copper electrode. |
Close |
|
|
|